An Experimental Investigation of the Film-to-Substrate Bond Strength of Sputtered Thin Film Using a Semi-Quantitative Test Method

[+] Author and Article Information
Bond-Yen Ting, W. O. Winer

School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

S. Ramalingam

Department of Mechanical Engineering and The Productivity Center, University of Minnesota, Minneapolis, MN 55455

J. Tribol 107(4), 478-482 (Oct 01, 1985) (5 pages) doi:10.1115/1.3261112 History: Received January 18, 1985; Online October 29, 2009


The experimentally measured adhesion strength of thin films of titanium and titanium nitride deposited on aluminum and AISI 304 stainless steel substrates are reported. A semi-quantitative test method presented and discussed in a companion paper was used to measure the film-to-substrate bond strength. The test results obtained show that the surface cleaning and preparation procedures used prior to film deposition dominate thin film adhesion. The results obtained also show that thin soft and hard films with film-to-substrate bond strength sufficient for heavily loaded tribological applications can be produced with magnetron sputtering techniques.

Copyright © 1985 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In