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RESEARCH PAPERS

A Finite Element Analysis of Contact Stress and Strain in an Elastic Film on a Rigid Substrate—Part II: With Friction

[+] Author and Article Information
T. Ihara

Tokyo Institute of Technology, Tokyo, Japan

M. C. Shaw

Arizona State University, Tempe, Ariz.

B. Bhushan

IBM Almaden Research Center, San Jose, CA 95120-6099

J. Tribol 108(4), 534-539 (Oct 01, 1986) (6 pages) doi:10.1115/1.3261257 History: Received November 28, 1985; Online October 29, 2009

Abstract

Deformation and elastic stress characteristics are considered for a thin elastic film on a rigid substrate when loaded by a rigid cylindrical indentor in conjunction with different amounts of friction. Friction tends to move the point of maximum shear stress from below the loaded surface into this surface, particularly when the elastic film is thin relative to the width of contact. Increased friction also increases the magnitude of the horizontal tensile stress (σx ) in the free top surface and moves it closer to the trailing edge of the indentor. Friction has a rather negligible influence on the depth of deformation for a given loading condition but substantially increases the magnitude of the peak normal stress in the loaded surface and moves it toward the leading edge of the indentor.

Copyright © 1986 by ASME
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