Mechanism for Subambient Interfacial Pressures While Polishing With Liquids

[+] Author and Article Information
Joseph A. Levert, Steven Danyluk

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

John Tichy

Department of Mechanical Engineering, Aeronautical Engineering & Mechanics, Rensselaer Polytechnic Institute, Troy, NY 12180-3590

J. Tribol 122(2), 450-457 (Aug 24, 1999) (8 pages) doi:10.1115/1.555381 History: Received July 14, 1998; Revised August 24, 1999
Copyright © 2000 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Schematic diagram of the experimental apparatus. The view (upper) shows the sample position with respect to the turntable center while the side view (lower) shows the location of the three capacitance probes for vertical wafer differential displacement measurement. The expanded view shows the sample with pressure sensing holes for measurement of subambient pressures.
Grahic Jump Location
Diagram of subambient pressure mechanism showing the wafer bottom view (upper), pad/wafer cross section (lower view), and the polishing pad contact stress as a function of wafer diameter
Grahic Jump Location
Flow chart of the model solution algorithm showing the four major parts
Grahic Jump Location
Static pad deformation (μm) versus pressure (kPa) for a 100 mm diameter wafer on a water-wetted perforated pad after conditioning with 7.5 μm Ra roughness. The slope of the linear regression (solid line) along with the pad thickness (1.25 mm) was used to determine the value of the pad modulus (complianceL).
Grahic Jump Location
Liquid pressure distributions used in model
Grahic Jump Location
Diagram of the in-flow length (l,lc) and width (b,bc) dimensions used in the model for liquid pressure calculations
Grahic Jump Location
Vertical differential wafer displacement (μm) as a function of speed (m/s) for a slurry of viscosity 2.3 cps and water of viscosity 1.0 cps comparing model predictions and experimental data. The data were obtained for a 48.3 kPa normal load on an unperforated pad (with 7.5 μm Ra roughness).
Grahic Jump Location
Comparison of predicted and experimental curves of liquid pressure (kPa) as a function of wafer position (μm) for three turntables speeds. The data were obtained for a 20.3 kPa normal load on an unperforated pad (with 7.5 μm (Ra) roughness) with water as a lubricant.




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In