Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing

[+] Author and Article Information
Lei Shan, Joseph Levert, Lorne Meade, Steven Danyluk

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

John Tichy

Department of Mechanical Engineering, Aeronautical Engineering and Mechanics, Rensselaer Polytechnic Institute, Troy, NY 12180-3590

J. Tribol 122(3), 539-543 (Jul 06, 1999) (5 pages) doi:10.1115/1.555398 History: Received March 16, 1999; Revised July 06, 1999
Copyright © 2000 by ASME
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Experimental setup and schematic diagram of both top and side view of the pressure sampling fixture
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Pressure variation versus data sampling time, for a pad roughness of 5 μm, velocity of 0.16 m/s, and 20 kPa normal load
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Pressure data sampling and interfacial pressure mapping, for a sample loaded at 20 kPa and a pad roughness of 5 μm, and 0.43 m/s velocity
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Interfacial fluid pressure distribution versus velocity, for a 20 kPa normal load and 5 μm pad roughness
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Fluid pressure (the average of hole 6, 7, and 8) versus velocity, for a sample loaded at 20 kPa for two pad roughness
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The effect of the unit normal load on the interfacial fluid pressure for a velocity of 0.7 m/s and unit normal load of 20 kPa
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Schematic diagram of the physical system (with compressed asperities), contact stress, and predicted pressure distribution
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A high resolution surface profile of polishing pad (Ra=5 μm) obtained with HRP-100 contact profiler
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Contact stress σ(x) versus location x, for a sample loaded at 20 kPa and an average fluid pressure of −13.4 kPa
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Film thickness h(x) versus location x, for a pad of an average surface roughness of 5 μm
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Fluid pressure p(x) versus location x. A comparison of model (dash line) and measurement (solid line), at a velocity of 0.43 m/s.




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