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TECHNICAL PAPERS

A Microcontact Approach for Ultrasonic Wire Bonding in Microelectronics

[+] Author and Article Information
Yeau-Ren Jeng

Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwane-mail: imeyrj@ccunix.ccu.edu.tw

Jeng-Haur Horng

Department of Power Mechanical Engineering, National Huwei Institute of Technology

J. Tribol 123(4), 725-731 (Dec 06, 2000) (7 pages) doi:10.1115/1.1352744 History: Received June 06, 2000; Revised December 06, 2000
Copyright © 2001 by ASME
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References

Figures

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Model for contact of rough surfaces
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Schematic of ultrasonic wire bonding machine
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Weldable range diagram of ultrasonic power versus welding time for Surface A under different loadings
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Weldable range diagram of ultrasonic powers versus welding time at load of (a) 0.05 N, (b) 0.10 N, and (c) 0.15 N for different surfaces
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Relationship between pull strength and welding time for different surfaces at power of 0.05 W and load of (a) 0.05 N, (b) 0.10 N, and (c) 0.15 N
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Relationship between pull strength and welding time under different loads at power of 0.05 W for Surface A
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Variation of frictional energy with welding time for different loads
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Variation of energy intensity with welding time at the load of 0.05 N for different surfaces
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Variation of energy intensity with welding time for Surface A under different loadings

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