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TECHNICAL PAPERS

A Microcontact Approach for Ultrasonic Wire Bonding in Microelectronics

[+] Author and Article Information
Yeau-Ren Jeng

Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwane-mail: imeyrj@ccunix.ccu.edu.tw

Jeng-Haur Horng

Department of Power Mechanical Engineering, National Huwei Institute of Technology

J. Tribol 123(4), 725-731 (Dec 06, 2000) (7 pages) doi:10.1115/1.1352744 History: Received June 06, 2000; Revised December 06, 2000
Copyright © 2001 by ASME
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References

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Figures

Grahic Jump Location
Model for contact of rough surfaces
Grahic Jump Location
Schematic of ultrasonic wire bonding machine
Grahic Jump Location
Weldable range diagram of ultrasonic power versus welding time for Surface A under different loadings
Grahic Jump Location
Weldable range diagram of ultrasonic powers versus welding time at load of (a) 0.05 N, (b) 0.10 N, and (c) 0.15 N for different surfaces
Grahic Jump Location
Relationship between pull strength and welding time for different surfaces at power of 0.05 W and load of (a) 0.05 N, (b) 0.10 N, and (c) 0.15 N
Grahic Jump Location
Relationship between pull strength and welding time under different loads at power of 0.05 W for Surface A
Grahic Jump Location
Variation of frictional energy with welding time for different loads
Grahic Jump Location
Variation of energy intensity with welding time at the load of 0.05 N for different surfaces
Grahic Jump Location
Variation of energy intensity with welding time for Surface A under different loadings

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