0
TECHNICAL PAPERS

Study of Interfacial Phenomena Affecting Thermosonic Wire Bonding in Microelectronics

[+] Author and Article Information
Yeau-Ren Jeng

Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi 621, Taiwane-mail: imeyrj@ccu.edu.tw.

Jeng-Nan Lin

Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi 621, Taiwan

J. Tribol 125(3), 576-581 (Jun 19, 2003) (6 pages) doi:10.1115/1.1537265 History: Received May 17, 2002; Revised August 20, 2002; Online June 19, 2003
Copyright © 2003 by ASME
Your Session has timed out. Please sign back in to continue.

References

Clatterbaugh,  G. V., and Charles,  H. K., 1990, “The Effect of High-Temperature Intermetallic Growth on Ball Shear-Induced Cratering,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 13, pp. 167–175.
Hu,  S. J., Lim,  G. E., Lim,  T. L., and Foong,  K. P., 1991, “Study of Temperature Parameter on the Thermosonic Gold Wire Bonding of High-Speed CMOS,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 14, pp. 855–858.
Hu,  S. J., Lim,  R. K. S., and Sow,  G. Y., 1995, “Gold Wire Weakening in the Thermosonic Bonding of the First Bond,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 18, pp. 230–234.
Michael,  J. P., Michael,  J. B., and Tamara,  I. S., 1999, “Thermosonic Wire Bonding to Laminate Substrates with Palladium Surface Finishes,” ASME J. Electron. Packag., 22, pp. 7–15.
Jeng,  Y. R., and Horng,  J. H., 2001, “A Microcontact Approach for Ultrasonic Wire Bonding in Microelectronics,” ASME J. Tribol., 123, pp. 1–7.
Greenwood,  J. A., and Willamson,  J. B. P., 1966, “Contact of Nominally Flat Surfaces,” Proc. R. Soc. London, Ser. A, A295, pp. 300–319.
Pullen,  J., and Williamson,  J. B. P., 1972, “On the Plastic Contact of Rough Surfaces,” Proc. R. Soc. London, Ser. A, A327, pp. 157–173.
McCool,  J. I., 1987, “Relating Profile Instrument Measurements to the Functional Performance of Rough Surfaces,” ASME J. Tribol., 109, pp. 264–270.
McCool,  J. I., 1988, “The Distribution of Microcontact Area, Load, Pressure, and Flash Temperature Under the Greenwood-Williamson Model,” ASME J. Tribol., 110, pp. 106–111.
Chang,  W. R., Etsion,  I., and Bogy,  D. B., 1987, “An Elastic-Plastic Model for the Contact of Rough Surfaces,” ASME J. Tribol., 110, pp. 50–56.
Tabor, D., 1950, The Hardness of Metals, Oxford University Press, United Kingdom.

Figures

Grahic Jump Location
Schematic of a thermosonic wire bonding machine
Grahic Jump Location
Model for contact of rough surfaces
Grahic Jump Location
Variation of apparent contact area with (a) bonding force, (b) ultrasonic power, (c) welding time, and (d) capillary sink
Grahic Jump Location
Variation of shear force with (a) bonding force, (b) ultrasonic power, (c) welding time, and (d) capillary sink
Grahic Jump Location
Variation of shear force with apparent contact area for different parameters
Grahic Jump Location
Variation of real contact area with ultrasonic power, bonding force and welding time
Grahic Jump Location
Relationship between shear force and real contact area for different parameters
Grahic Jump Location
Variation of frictional energy intensity with ultrasonic power, bonding force and welding time
Grahic Jump Location
Relationship between shear force and frictional energy intensity for different parameters

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In