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TECHNICAL PAPERS

Study of Interfacial Phenomena Affecting Thermosonic Wire Bonding in Microelectronics

[+] Author and Article Information
Yeau-Ren Jeng

Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi 621, Taiwane-mail: imeyrj@ccu.edu.tw.

Jeng-Nan Lin

Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi 621, Taiwan

J. Tribol 125(3), 576-581 (Jun 19, 2003) (6 pages) doi:10.1115/1.1537265 History: Received May 17, 2002; Revised August 20, 2002; Online June 19, 2003
Copyright © 2003 by ASME
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References

Figures

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Schematic of a thermosonic wire bonding machine
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Model for contact of rough surfaces
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Variation of apparent contact area with (a) bonding force, (b) ultrasonic power, (c) welding time, and (d) capillary sink
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Variation of shear force with (a) bonding force, (b) ultrasonic power, (c) welding time, and (d) capillary sink
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Variation of shear force with apparent contact area for different parameters
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Variation of real contact area with ultrasonic power, bonding force and welding time
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Relationship between shear force and real contact area for different parameters
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Variation of frictional energy intensity with ultrasonic power, bonding force and welding time
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Relationship between shear force and frictional energy intensity for different parameters

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