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TECHNICAL PAPERS

Pad Soaking Effect on Interfacial Fluid Pressure Measurements During CMP

[+] Author and Article Information
Sum Huan Ng, Robert Hight, Chunhong Zhou, Inho Yoon, Steven Danyluk

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Tribol 125(3), 582-586 (Jun 19, 2003) (5 pages) doi:10.1115/1.1538632 History: Received February 27, 2002; Revised October 03, 2002; Online June 19, 2003
Copyright © 2003 by ASME
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References

Jairath,  R., Farkas,  J., Huang,  C. K., Stell,  M., and Tzeng,  S-M., 1994, “Chemical-Mechanical Polishing: Process Manufacturability,” Solid State Technol., 37(7), pp. 71–77.
Li,  S. H., and Miller,  R. O., 2000, “Chemical Mechanical Polishing in Silicon Processing,” Semicond. Semimetals, 63 pp. 159.
Shan, L., 2000, “Mechanical Interactions at the Interface of Chemical Mechanical Polishing,” Ph.D. thesis, Georgia Inst. of Tech., Atlanta, GA.
Oliver, M. R., Schmidt, R. E., and Robinson, M., “CMP Pad Surface Roughness and CMP Removal Rate,” paper from the internet: http://www.rodel.com/common/ca/list.asp?caid=25&groupname=2000
Murarka, S. P., and Gutmann, R., 1994, “1994 Annual Report of the New York State SCOE,” Semiconductor Research Corporation, Research Triangle Park, NC.
Obeng, Y., Dogariu, A., and Forsthoefel, K., “Mechanical and Chemical Properties of Pads for Use in Chemo-Mechanical Processing (CMP),” from the internet: http://www.creol.ucf.edu/people/faculty/kcr/cmp2.pdf
Hogan,  J. M., Pearson,  C. J., Rogers,  T. H., and White,  J. R., 1973, “Humidity Characteristics of HR and Hot Urethane Foams,” J. Cell. Plast., Sept./Oct., pp. 219–225.
Philips, L. N., and Parker, D. B. V., 1964, Polyurethanes: Chemistry, Technology and Properties, Iliffe Books, London, pp. 98–100.
Levert, J. L., 1997, “Interface Mechanics of Chemical Mechanical Polishing for Integrated-Circuit Planarization,” Ph.D. thesis, Georgia Inst. of Tech., Atlanta, Georgia.
Shan, L., Levert, J. L., and Danyluk, S., Apr 1998, “Pressure Distribution at the Silicon/Polishing Pad Interface,” Proceedings of ASPE Spring Topical Meeting on Silicon Machining, pp. 96–100.
Shan,  L., Levert,  J. L., Meade,  L., Tichy,  J., and Danyluk,  S., 2000, “Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing,” ASME J. Tribol., 122(3), pp. 539–543.
Johnson, K. L., 1985, Contact Mechanics, Cambridge University Press, Cambridge, UK, pp. 41.
Greenwood,  J. A., and Williamson,  J. B. P., 1966, “Contact of Nominally Flat Rough Surfaces,” Proc. R. Soc. London, Ser. A, A295, pp. 300–319.

Figures

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Schematic diagram of the polishing and pressure measurement apparatus
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Pad weight (percent) versus soaking time (hrs) for Rodel IC1000 pad
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Weight increase (percent) versus soaking time (hrs) for different size pads
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Comparison of normalized weight increase with volume and dimension of different size pads (mm)
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Low magnification optical micrograph of a cross sectional view of pad soaked in black ink
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High magnification optical micrograph of a cross sectional view of pad soaked in black ink
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Optical micrograph of the surface of the pad showing interconnected pores linked both laterally and into the pad
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Elastic modulus of IC1000 pad versus soaking time
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Interfacial fluid pressure (kPa) versus sensor position for different pad soaking time
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Maximum interfacial fluid pressure (kPa) versus pad soaking time (hrs) for a load of 14.15 kPa and platen speed of 100 rpm
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Interfacial fluid pressure (kPa) (at v=0.15 m/s) versus location predicted by the model for different pad elastic moduli

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