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TECHNICAL PAPERS

A Model for Temperature Rise of Polishing Process Considering Effects of Polishing Pad and Abrasive

[+] Author and Article Information
Jeng-Haur Horng

Department of Power Mechanical Engineering, National Huwei Institute of Technology, Huwei, Yunlin 632, Taiwan

Yeau-Ren Jeng, Chun-Liang Chen

Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwan

J. Tribol 126(3), 422-429 (Jun 28, 2004) (8 pages) doi:10.1115/1.1705665 History: Received January 28, 2003; Revised September 18, 2003; Online June 28, 2004
Copyright © 2004 by ASME
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References

Figures

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Schematic diagram of the polishing process
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Schematic diagram of the interaction between abrasive particles, workpiece and polishing pad
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Effect of different workpiece and particle size for average contact temperature (Taw,ave)
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Variation of contact force ratio of abrasive-workpiece and pad-workpeice with particle size for the different hardness of pad
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Variation of maximum and average contact temperature rise of abrasive-workpiece (Taw,max and Taw,ave) with particle size for different polishing workpiece
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Variation of maximum and average contact temperature rise of pad-workpiece (Tpw,max and Tpw,ave) with particle size for different polishing workpiece
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Variation of maximum temperature rise of abrasive-workpiece (Taw,max) with particle size for the polishing of different hardness of pad
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Variation of maximum temperature rise of pad-workpiece (Tpw,max) with particle size for the polishing of different workpiece and different hardness of pad
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Variation of maximum and average contact temperature rise of abrasive-workpiece (Taw,max and Taw,ave) with particle density for the different polishing workpiece
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Variation of maximum and average contact temperature rise of pad-workpiece (Tpw,max and Tpw,ave) with particle density for the polishing of different workpiece
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Variation of contact force ratio of particles and pad with surface roughness
Grahic Jump Location
Variation of maximum and average contact temperature rise of abrasive-workpiece (Taw,max and Taw,ave) with surface roughness for the polishing of different workpiece
Grahic Jump Location
Variation of maximum and average contact temperature rise of pad-workpiece (Tpw,max and Tpw,ave) with surface roughness for the different polishing workpiece

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