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TECHNICAL PAPERS

Adhesion and Friction Studies of Silicon and Hydrophobic and Low Friction Films and Investigation of Scale Effects

[+] Author and Article Information
Bharat Bhushan, Huiwen Liu

Nanotribology Laboratory for Information, Storage and MEMS/NEMS, The Ohio State University, 206 W 18th Avenue, Columbus, OH 43210-1107

Stephen M. Hsu

National Institute of Standards and Technology, Gaithersburg, MD 20899

J. Tribol. 126(3), 583-590 (Jun 28, 2004) (8 pages) doi:10.1115/1.1739407 History: Received August 06, 2003; Revised October 17, 2003; Online June 28, 2004
Copyright © 2004 by ASME
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References

Figures

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(a) The influence of rest time on the adhesive force of Si(100), DLC, chemically bonded Z-DOL, and HDT, and (b) single asperity contact modeling results of the rest time effect on the meniscus force for an asperity of R in contact with a flat surface with a water film thickness of h0 and absolute velocity of η 17
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(a) Adhesive forces of Si(100), DLC, chemically bonded Z-DOL, and HDT at ambient condition and the contact angle values and the calculated Laplace values, and (b) a schematic showing the relative size of water meniscus on different specimens
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Variation of friction force as a function of normal load curves obtained on Si(100), DLC, chemically bonded Z-DOL, and HDT, and coefficient of friction (μ) values
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The influence of sliding velocity on the friction forces of Si(100), DLC, chemically-bonded Z-DOL, and HDT
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The influence of relative humidity on the adhesive and friction forces of Si(100), DLC, chemically-bonded Z-DOL, and HDT
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The influence of temperature on the adhesive and friction forces of Si(100), DLC, chemically bonded Z-DOL, and HDT
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Adhesive force and coefficient of friction as a function of tip radius at several humidities and as a function of relative humidity at several tip radii on Si(100) (Bhushan and Sundararajan 22)
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Coefficient of friction as a function of normal load and corresponding wear depth as a function of normal load for silicon, SIO2 coatings, and natural diamond. Inflections in the curves for silicon and SiO2 correspond to the contact stresses equal to the hardness of these materials (Bhushan and Kulkarni 29).

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