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RESEARCH PAPERS

Study of Nanoindentation Using FEM Atomic Model

[+] Author and Article Information
Yeau-Ren Jeng

Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwan

Chung-Ming Tan

Department of Mechanical Engineering, National Chung Cheng University, Chia-Yi, Taiwan;Department of Mechanical Engineering, WuFeng Institute of Technology, Chia-Yi, Taiwan

J. Tribol 126(4), 767-774 (Nov 09, 2004) (8 pages) doi:10.1115/1.1792679 History: Received November 24, 2003; Revised March 11, 2004; Online November 09, 2004
Copyright © 2004 by ASME
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References

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Figures

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(a) Atomistic model used in present nanoindentation simulation and (b) Three-dimensional illustration of monocrystalline fcc copper thin film
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Interatomic potential energy functions used in present simulation, and corresponding parameter values
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(a) Load versus indentation depth curve of complete nanoindentation cycle, and (b) Configuration of deformed thin film after completion of nanoindentation cycle.
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Flooded contour subplots of hydrostatic stress/strain and deviatoric stress/strain evaluated at maximum indentation depth
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Flooded contour subplots of hydrostatic stress/strain and deviatoric stress/strain evaluated after completion of nanoindentation cycle
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Load versus indentation depth curves and configuration of deformed thin films after completion of nanoindentation cycle for six different maximum indentation depths
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(a) Load versus indentation depth curves, and (b) Deviatoric strains in thin film calculated at the maximum indentation depth for one can in which the constraint boundary condition at the base of the thin film is released, and in a second case where the thickness of the thin film is doubled
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Load versus indentation depth curves and deviatoric strains in thin film calculated after completion of nanoindentation cycle for one case in which the constraint boundary conditions at either end of the film are released, and in a second case where the length of the thin film is doubled
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(a) Load versus indentation depth curves for three different indenter angles, and corresponding deformed configuration of thin films after completion of nanoindentation cycle, (b) 75 deg, (c) 90 deg, and (d) 105 deg

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