Tilt and Interfacial Fluid Pressure Measurements of a Disk Sliding on a Polymeric Pad

[+] Author and Article Information
Sum Huan Ng, Inho Yoon, Andrés Osorno, Steven Danyluk

George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

Len Borucki

Intelligent Planar, Mesa, AZ 85205

C. Fred Higgs

Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA 15213

J. Tribol 127(1), 198-205 (Feb 07, 2005) (8 pages) doi:10.1115/1.1829718 History: Received February 25, 2004; Revised May 28, 2004; Online February 07, 2005
Copyright © 2005 by ASME
Your Session has timed out. Please sign back in to continue.


Li,  S. H., and Miller,  R. O., 2000, “Chemical Mechanical Polishing in Silicon Processing,” Semicond. Semimetals, 63, pp. 1–4.
Steigerwald, J. M., Murarka, S. P., and Gutmann, R. J., 1985, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley and Sons Inc., New York, N.Y.
Levert, J. L., 1997, “Interface Mechanics of Chemical Mechanical Polishing for Integrated-Circuit Planarization,” Ph.D., thesis, Georgia Institute of Technology, Atlanta, GA.
Levert,  J., Baker,  A., Mess,  F., Danyluk,  S., Salant,  R., and Cook,  L., 1998, “Mechanisms of Chemical-Mechanical Polishing of SiO2 Sielectric on Integrated Circuits,” Tribol. Trans., 41(4), pp. 593–599.
Levert,  J., Danyluk,  S., and Tichy,  J., 2000, “Mechanism for Subambient Interfacial Pressures While Polishing with Liquids,” ASME J. Tribol., 122, p. 450.
Preston,  F. W., 1927, “The Theory and Design of Plate Glass Polishing Machines,” J. Soc. Glass Technol., 11, pp. 214–217.
Shan, L., Levert, J. L., and Danyluk, S., 1998, “Pressure Distribution at the Silicon/Polishing Pad Interface,” Proc. of ASPE Spring Topical Meeting on Silicon Machining, pp. 96–100.
Shan,  L., Levert,  J. L., Meade,  L., Tichy,  J. A., and Danyluk,  S., 2000, “Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing,” ASME J. Tribol., 122(3), pp. 539–543.
Shan,  L., Zhou,  C., and Danyluk,  S., 2001, “Mechanical Interactions and Their Effects on Chemical Mechanical Polishing,” IEEE Trans. Semicond. Manuf., 14(3), pp. 207–213.
Ng,  S. H., Hight,  R., Zhou,  C., Yoon,  I., and Danyluk,  S., 2003, “Pad Soaking Effect on Interfacial Fluid Pressure Measurements During CMP,” ASME J. Tribol., 125(3), pp. 582–586.
Johnson, K. L., 1985, Contact Mechanics, Cambridge University Press, Cambridge, U.K.
Greenwood,  J. A., and Williamson,  J. B. P., 1966, “Contact of Nominally Flat Rough Surfaces,” Proc. R. Soc. London, Ser. A, 295, pp. 300–319.
Hamrock, B. J., 1994, Fundamentals of Fluid Film Lubrication, McGraw-Hill, New York.
Higgs ,  C. F., Ng,  S. H., Yoon,  I., Shan,  L., Yap,  L., and Danyluk,  S., 2003, “Mechanical Modeling of the 2D Interfacial Slurry Pressure in CMP,” Mater. Res. Soc. Symp. Proc., 767, pp. 305–312.
Higgs ,  C. F., Ng,  S. H., Borucki,  L., and Danyluk,  S., 2004, “A Mixed-Lubrication Approach to Predicting CMP Fluid Pressure: Modeling and Experiments,” J. Electrochem. Soc., submitted for publication.
Shan, L., 2000, “Mechanical Interactions at the Interface of Chemical Mechanical Polishing,” Ph.D. thesis, Georgia Institute of Technology, Atlanta, GA.
Kim, A. T., Seok, J., Sukam, C., Tichy, J. A., and Cale, T. S., 2001, “A Multiscale Model for Chemical Mechanical Planarization,” Advanced Metallization Conference, pp. 405–409.
Blatz,  P. J., and Ko,  W. L., 1962, “Application of Finite Elastic Theory to the Deformation of Rubbery Materials,” Trans. Soc. Rheol., VI, pp. 223–251.
Ng,  S. H., Higgs,  C. F., Yoon,  I., and Danyluk,  S., 2004, “An Analysis of Mixed Lubrication in Chemical Mechanical Polishing,” ASME J. Tribol., (accepted).
Ng,  S. H., Yoon,  I., Higgs,  C. F., and Danyluk,  S., 2004, “Wafer Bending Experiments in Chemical Mechanical Polishing,” J. Electrochem. Soc., submitted for publication.


Grahic Jump Location
Pressure measurement disk
Grahic Jump Location
Experimental layout for pressure mapping
Grahic Jump Location
Pressure maps from experiment (colorbar units in kPa)
Grahic Jump Location
Sensors layout and side view of disk tilt setup
Grahic Jump Location
Definition of the tilt angles
Grahic Jump Location
Speed and load effect on ϕ, θ, dz
Grahic Jump Location
Flowchart for computation
Grahic Jump Location
Pressure maps from model
Grahic Jump Location
Effect on ϕ, θ, dz using wafer carrier
Grahic Jump Location
Details of wafer carrier for wafer bending experiments
Grahic Jump Location
Layouts for dynamic wafer bending experiments
Grahic Jump Location
Contact pressure from model (x,y-axes in meters)




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In