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Research Papers: Friction & Wear

Comparison of Interfacial Forces During Post-Chemical-Mechanical-Polishing Cleaning

[+] Author and Article Information
Dedy Ng

Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123

Hong Liang1

Department of Mechanical Engineering, Texas A&M University, College Station, TX 77843-3123hliang@tamu.edu

1

Corresponding author.

J. Tribol 130(2), 021603 (May 07, 2008) (5 pages) doi:10.1115/1.2908896 History: Received April 17, 2006; Revised October 29, 2007; Published May 07, 2008

This research investigates the interfacial forces involved in tribological interactions while removing nanosized particles during post-chemical-mechanical polishing cleaning. Surface and interfacial forces are discussed to understand the particle adhesion and subsequent removal through physical and chemical interactions. Approaches include theoretical analysis combined with experimental study. The theoretical analysis was focused on the forces that exist between particles and a substrate. Surface interaction consideration includes applied pressure, frictional force, and hydrodynamic drag. The polishing experiments were carried out on silicon wafers with SiO2 slurry. Cleaning experiments were performed in de-ionized water using a polyvinyl acetal brush to remove particles from a hydrophilic-silicon surface. The fluid-drag force was found to affect the lubricating behavior of cleaning through changing material properties. Values of interfacial forces and their effects on cleaning were discussed along with a lubricating model system.

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Copyright © 2008 by American Society of Mechanical Engineers
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References

Figures

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Figure 2

Schematic drawing of post-CMP cleaning setup

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Figure 3

Adhesion forces as a function of particle radius during cleaning

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Figure 4

Average friction coefficient as a function of speed at different applied load and number of cycle

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Figure 5

Modified Stribeck curve for a soft material sliding against solid surface

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Figure 1

Schematic of the interfacial forces on a particle∕wafer interface

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