Topics: Design , Reliability , Thin films , Fracture (Materials) , Crack propagation , Semiconductor wafers , Pressure , Stress , Adhesion , Delamination

Reliability Analysis of WLCSP Using Tie-Release Crack Prediction Finite Element Technique

Chang-Chun Lee, Kuo-Ning Chiang

IMECE 2005; 7-12doi:https://doi.org/10.1115/IMECE2005-79717

Abstract

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Topics: Event history analysis , Finite element analysis , Fracture (Materials) , Reliability

Design and Analysis of a Warpage Measurement System to Simulate Convective Reflow

Reinhard E. Powell, I. Charles Ume

IMECE 2005; 13-21doi:https://doi.org/10.1115/IMECE2005-79975

Abstract

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Topics: Design , Measurement systems , Warping , Heating , Printed circuit boards , Ovens , Computational fluid dynamics , Engineering simulation , Simulation

Effects of Dwell-Time and Ramp-Rate on The Thermal-Fatigue Life of SnAgCu Joints

Walter Dauksher, John Lau

IMECE 2005; 23-28doi:https://doi.org/10.1115/IMECE2005-79984

Abstract

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Topics: Creep , Density , Fatigue , Finite element analysis

Wirebond Reliability Assessments and Layout Guidelines for a TO247 Package Using FEA

Rohit T. Nayak, Judy Cheng Chean Fay, Arvind Krishna

IMECE 2005; 29-36doi:https://doi.org/10.1115/IMECE2005-80078

Abstract

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Topics: Finite element analysis , Reliability , Wire , Aluminum , Design , Stress , Finite element model , Thermal stresses , Bonding , Damage

Board Strain Analysis to Investigate Chassis Design Effects

Frank Z. Liang, Larry M. Palanuk, Richard L. Williams, Paresh Daharwal

IMECE 2005; 37-44doi:https://doi.org/10.1115/IMECE2005-80086

Abstract

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Topics: Ball-Grid-Array packaging , Design , Manufacturing , Printed circuit boards , Reliability , Risk , Strain gages

Board Deflection/Strain Instead of Acceleration Measurements for Circuit Board FE Shock Model Validation

Frank Z. Liang, Richard L. Williams, Wade Hezeltine

IMECE 2005; 45-50doi:https://doi.org/10.1115/IMECE2005-80093

Abstract

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Topics: Deflection , Model validation , Printed circuit boards , Shock (Mechanics) , Reliability , Simulation , Simulation models , Stress

Evaluation of Creep Properties in Soldering Ball by Nanoindentation Creep

Tadahiro Shibutani, Qiang Yu, Masaki Shiratori

IMECE 2005; 51-55doi:https://doi.org/10.1115/IMECE2005-80160

Abstract

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Topics: Creep , Nanoindentation , Soldering , Stress , Diffusion (Physics) , Hydrostatics , Alloys , Chemical potential , Deformation , Finite element methods

Effect of Voids on Thermo-Mechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

Leila Jannesari Ladani, Abhijit Dasgupta

IMECE 2005; 57-63doi:https://doi.org/10.1115/IMECE2005-80238

Abstract

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Topics: Ball-Grid-Array packaging , Durability , Finite element analysis , Modeling , Simulation , Solder joints , Thermomechanics

Reliability of Underfilled Chip Scale Packages Attached With Heat Sink

Saketh Mahalingam, Ashutosh Joshi, Joseph Lacey, Kunal Goray

IMECE 2005; 65-69doi:https://doi.org/10.1115/IMECE2005-80673

Abstract

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Topics: Heat sinks , Reliability , Adhesives , Ball-Grid-Array packaging , Solder joints , Manufacturing , Operating temperature , Stress

Assessment of Influence and Analysis of Mechanism on the Reliability for Solder Joints of Electronic Device

Qiang Yu, Jae-Chul Jin, Hirokazu Abe, Takahiro Koyama, Tadahiro Shibutani, Masaki Shiratori

IMECE 2005; 71-76doi:https://doi.org/10.1115/IMECE2005-80887

Abstract

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Topics: Reliability , Solder joints

Mechanical Reliability Evaluation of Chip Scale Power Package

Kaushik Ghosh, F. Patrick McCluskey, Victor A. K. Temple

IMECE 2005; 77-85doi:https://doi.org/10.1115/IMECE2005-81111

Abstract

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Topics: Reliability , Failure , Solders , Fatigue , Modeling , Stress analysis (Engineering) , Cooling , Creep , Cycles , Damage

Evaluation of Bare Die Chip Reliability Due to Underfill Materials During Mechanical Actuation and Thermal Cycling

Arv Sinha

IMECE 2005; 87-91doi:https://doi.org/10.1115/IMECE2005-81482

Abstract

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Topics: Reliability

Reliability Study of Package Stacking Under Thermomechanical Conditions

Jiansen Zhu, Kazuo Ishibahsi, Tommi Reinikainen

IMECE 2005; 93-97doi:https://doi.org/10.1115/IMECE2005-81822

Abstract

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Topics: Finite element analysis , Modeling , Printed circuit boards , Reliability , Simulation , Simulation results , Testing , Thermomechanics

Hybrid Simulation Method for PWB Level Drop Tests

Jiansen Zhu, Esa Hussa, Juscelino Okura, Santosh Shetty

IMECE 2005; 99-105doi:https://doi.org/10.1115/IMECE2005-81825

Abstract

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Topics: Printed circuit boards , Simulation , Rubber , Vehicles , Deformation , Impulse (Physics) , Materials properties , Modeling , Reliability , Shock (Mechanics)

Transient Analysis on Hygroscopic Swelling Characterization Using Sequentially Coupled Moisture Diffusion and Hygroscopic Stress Modeling Approach

Jiang Zhou, Tong Yan Tee, Xueren Zhang

IMECE 2005; 107-114doi:https://doi.org/10.1115/IMECE2005-81847

Abstract

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Topics: Diffusion (Physics) , Modeling , Stress , Transient analysis , Deformation , Displacement

Correlation Between the Strain on the Printed Circuit Board and the Stress in Chips for the Failure Prediction of Passive Components

Dennis Lau, S. W. Ricky Lee

IMECE 2005; 115-121doi:https://doi.org/10.1115/IMECE2005-82084

Abstract

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Topics: Failure , Printed circuit boards , Stress , Capacitors , Density , Design , Manufacturing , Microelectronic devices , Packaging , Reliability

Experimental Investigation of the Effect of Reflow Cooling Rate on the IMC Growth of SAC Lead-Free Solder Alloy

Fubin Song, S. W. Ricky Lee

IMECE 2005; 123-129doi:https://doi.org/10.1115/IMECE2005-82095

Abstract

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Topics: Alloys , Cooling , Lead-free solders , Tin , Plates (structures) , Fracture (Materials) , Fracture (Process) , Solders , Mechanical properties , Solder joints

Integrated Reliability Solutions for New Component Development and Designs Optimization

Xiaohua Wu, Zhengfang Qian, Yinyan Wang

IMECE 2005; 131-137doi:https://doi.org/10.1115/IMECE2005-82320

Abstract

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Topics: Optimization , Reliability , Cycles , Engineering simulation , Engines , Experimental design , Simulation , Stack design , Design , Engineering prototypes

Failure Site Transition During Drop Testing of Printed Wiring Assemblies

Joseph Varghese, Bo Song, Michael H. Azarian, Abhijit Dasgupta, Michael Pecht

IMECE 2005; 139-146doi:https://doi.org/10.1115/IMECE2005-82428

Abstract

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Topics: Ball-Grid-Array packaging , Electrical wires , Failure , Intermetallic compounds , Testing

Strain-Based Flexure Assessment for the Printed Circuit Board Assembly Environment

W. Carter Ralph, Frank W. Joyce

IMECE 2005; 147-153doi:https://doi.org/10.1115/IMECE2005-82565

Abstract

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Topics: Bending (Stress) , Printed circuit board assemblies , Reliability

Shock and Vibration Survivability Prediction Using Failure Envelopes for Electronic and MEMS Packaging

Pradeep Lall, Dhananjay Panchagade, Prakriti Choudhary, Jeff Suhling, Sameep Gupte

IMECE 2005; 155-166doi:https://doi.org/10.1115/IMECE2005-82612

Abstract

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Topics: Failure , MEMS packaging , Shock (Mechanics) , Vibration , Damage , Design , Electronic packaging , Reliability , Transients (Dynamics) , Boundary-value problems

Methodologies for Prognostication and Health Monitoring of Leaded and Lead Free Electronics and MEMS Packages in Harsh Environments

Pradeep Lall, Nokibul Islam, Prakriti Choudhary, Jeff Suhling

IMECE 2005; 167-175doi:https://doi.org/10.1115/IMECE2005-82614

Abstract

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Topics: Electronics , MEMS packages , Damage , Failure , Ball-Grid-Array packaging , Design , Electronic components , Intermetallic compounds , Laminates , Solders

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Kun-Nan Chen

IMECE 2005; 177-183doi:https://doi.org/10.1115/IMECE2005-82655

Abstract

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Topics: Printed circuit boards , Design , Screws , Boundary-value problems , Computer cooling , Dynamic testing (Materials) , Electronic components , Finite element methods , Finite element model , Materials properties

High Reliability Flip Chip Using Low CTE Laminate Substrates

D. Scott Copeland, M. Kaysar Rahim, Jeffrey C. Suhling, Guoyun Tian, Pradeep Lall, Richard C. Jaeger, Kris Vasoya

IMECE 2005; 185-198doi:https://doi.org/10.1115/IMECE2005-82662

Abstract

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Topics: Flip-chip , Flip-chip devices , Laminates , Reliability , Testing , Modeling , Stress , Aircraft , Carbon , Carbon fibers

A Model of Shear Viscosity for Under-Fill Flows

R. Yang, D. C. Sun, Seungbae Park

IMECE 2005; 199-208doi:https://doi.org/10.1115/IMECE2005-82872

Abstract

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Topics: Flow (Dynamics) , Shear (Mechanics) , Viscosity , Particulate matter , Slurries , Fluid film lubrication , Packing (Shipments) , Packings (Cushioning) , Surface tension

Effect of Settlement on Dense Slurry Flow in a Horizontal Channel

R. Yang, D. C. Sun, Seungbae Park

IMECE 2005; 209-217doi:https://doi.org/10.1115/IMECE2005-82883

Abstract

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Topics: Flow (Dynamics) , Slurries , Particulate matter , Fluid film lubrication , Packing (Shipments) , Packings (Cushioning) , Slug flows

The Characterization of Underfill-Passivation Interface Under Monotonic and Fatigue Loading and Its Application to Flip Chip Reliability Prediction

Saketh Mahalingam, Sandeep Tonapi, Suresh K. Sitaraman

IMECE 2005; 219-224doi:https://doi.org/10.1115/IMECE2005-83029

Abstract

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Topics: Fatigue , Flip-chip , Flip-chip devices , Reliability , Delamination , Flip-chip packages , Solder joints , Computer simulation , Failure , Flow (Dynamics)

MEMS Packaging (Including Process and Reliability)

Sol-Gel Coating Facilitating Si-to-Si Wafer Bonding at Low Temperature

J. Wei, S. S. Deng, C. M. Tan

IMECE 2005; 225-229doi:https://doi.org/10.1115/IMECE2005-79263

Abstract

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Topics: Bonding , Coating processes , Coatings , Low temperature , Semiconductor wafers , Sol-gel processing , Bond strength , Silicon , Temperature , Bubbles

X-Ray Microanalysis of Metallic Thin Films

F. L. Ng, J. Wei

IMECE 2005; 231-235doi:https://doi.org/10.1115/IMECE2005-79319

Abstract

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Topics: Metallic thin films , X-ray microanalysis , Cathode ray oscilloscopes , Electron beams , Probes , Excitation , Film thickness , Manufacturing , Metallic films , Microelectromechanical systems

Studies of Temperature and Pressure Dependence in Thermocompression Gold Joints

X. F. Ang, G. G. Zhang, J. Wei, Z. Chen, C. C. Wong

IMECE 2005; 237-241doi:https://doi.org/10.1115/IMECE2005-79454

Abstract

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Topics: Pressure , Temperature , Bonding , Shear strength , Adhesives , Failure , Low temperature , Metal bonding , Packaging , Stress concentration

Effect of Presence of Carbon Nanotubes on the Wettability and Mechanical Performance of Sn-Ag-Cu Solder

S. M. L. Nai, J. Wei, Manoj Gupta

IMECE 2005; 243-246doi:https://doi.org/10.1115/IMECE2005-79457

Abstract

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Topics: Carbon nanotubes , Equipment performance , Solders , Tin , Composite materials , Temperature , Mechanical properties , Melting , Nanocomposites , Weight (Mass)

Effects of Catalysts Supporting Layer on Carbon Nanotubes Growth

K. P. Yung, J. Wei, B. K. Tay

IMECE 2005; 247-250doi:https://doi.org/10.1115/IMECE2005-80555

Abstract

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Topics: Carbon nanotubes , Catalysts

Structural Reliability of SU-8 Material for MEMS Application

S. B. Park, Soonwan Chung, Sandeep Makhar, Harold Ackler, Pinyen Lin

IMECE 2005; 251-258doi:https://doi.org/10.1115/IMECE2005-82647

Abstract

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Topics: Bone , Computer simulation , Deflection , Elastic moduli , Failure analysis , Fatigue , Finite element analysis , Fracture toughness , Mechanical properties , Membranes

Stress Analysis of a Novel MEMS Microphone Chip Using Finite Element Analysis

Jia Gao, Ronald N. Miles, Weili Cui

IMECE 2005; 259-267doi:https://doi.org/10.1115/IMECE2005-82823

Abstract

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Topics: Finite element analysis , Microelectromechanical systems , Microphones , Stress analysis (Engineering) , Stress , Manufacturing , Diaphragms (Mechanical devices) , Diaphragms (Structural) , Compressive stress , Failure mechanisms

A Room-Temperature Bonding Technique Using Ultrathin PDMS as an Intermediate Layer for Fabrication of Micron and Submicron Channels

Yonduck Sung, Yongjun Zhao, Qiao Lin

IMECE 2005; 269-272doi:https://doi.org/10.1115/IMECE2005-82824

Abstract

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Topics: Bonding , Manufacturing , Plasma desorption mass spectrometry , Temperature , Leakage , Adhesives , Microchannels , Oxygen , Plasmas (Ionized gases) , Pressure

Thermal Stress Analysis for Differential Pressure Sensors

J. Albert Chiou, Steven Chen

IMECE 2005; 273-278doi:https://doi.org/10.1115/IMECE2005-82946

Abstract

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Topics: Pressure sensors , Thermal stresses , Silicon , Stress , Temperature , Finite element analysis , Glass , Materials properties , Packaging , Plastic housings

Development of Conformal PDMS and Parylene Coatings for Microelectronics and MEMS Packaging

Hyungsuk Lee, Junghyun Cho

IMECE 2005; 279-283doi:https://doi.org/10.1115/IMECE2005-82955

Abstract

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Topics: Coatings , MEMS packaging , Microelectronic devices , Plasma desorption mass spectrometry , Packaging , Mechanical properties , Atomic force microscopy , Microelectromechanical systems , Nanoindentation , Electronic packaging

Automated Assembly and Hermetic Packaging of MOEMS for Applications Requiring Extended Shelf-Lives

Dan O. Popa, Michael Deeds, Abiodun Fasoro, Heather Beardsley, Jeongsik Sin, Woo Ho Lee, Raul Fernandez

IMECE 2005; 285-286doi:https://doi.org/10.1115/IMECE2005-82970

Abstract

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Topics: Manufacturing , Microoptoelectromechanical systems , Packaging , Lasers , Machinery , Microassembling , Reflow soldering , Robotics , Sealing (Process) , Wire bonding

Microelectronics/Optoelectronic Packaging

Realizing 3-D Interconnected Direct Write Electronics Within Smart Stereolithography Structures

Jeremy A. Palmer, Jeffrey L. Summers, Donald W. Davis, Phillip L. Gallegos, Bart D. Chavez, Pin Yang, Francisco Medina, Ryan B. Wicker

IMECE 2005; 287-293doi:https://doi.org/10.1115/IMECE2005-79360

Abstract

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Topics: Electronics , Stereolithography

Development of Advanced Lead-Free Solder Based Interconnect Materials Containing Nanosized Y₂O₃ Particulates

S. M. L. Nai, J. Wei, M. Gupta

IMECE 2005; 295-298doi:https://doi.org/10.1115/IMECE2005-79456

Abstract

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Topics: Lead-free solders , Particulate matter , Solders , Nanocomposites , Composite materials , Mechanical properties , Compacting , Density , Extruding , Flip-chip assemblies

Thermal-Mechanical Analysis of a Flip-Chip VCSEL (Vertical-Cavity Surface-Emitting Laser) Package With Low-Temperature Lead-Free (SnBi) Solder Joints

John Lau, Walter Dauksher

IMECE 2005; 299-324doi:https://doi.org/10.1115/IMECE2005-79981

Abstract

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Topics: Cavities , Failure analysis , Finishes , Flip-chip , Lasers , Low temperature , Solder joints

Characterization of Low-K Dielectrics Sol-Gel Coating by Spectroscopy Ellipsometry

H. Xie, J. Wei

IMECE 2005; 325-329doi:https://doi.org/10.1115/IMECE2005-80687

Abstract

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Topics: Coating processes , Coatings , Dielectric materials , Sol-gel processing , Spectroscopy , Ambiguity , Approximation , Integrated circuits , Porosity , Reflectance

Cyclic Mechanical Durability of Sn3.0Ag0.5Cu Pb-Free Solder Alloy

Gayatri Cuddalorepatta, Abhijit Dasgupta

IMECE 2005; 331-337doi:https://doi.org/10.1115/IMECE2005-81171

Abstract

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Topics: Alloys , Durability , Lead-free solders , Solders , Temperature , Energy dissipation , Damage , Fatigue , Mechanical testing , Microscale devices

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Board in Channel Flow Forced Convection Using Artificial Neural Networks

Tohru Suwa, Hamid Hadim

IMECE 2005; 339-347doi:https://doi.org/10.1115/IMECE2005-81483

Abstract

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Topics: Artificial neural networks , Channel flow , Electronic components , Forced convection , Heat , Optimization , Printed circuit boards , Temperature , Junctions , Heat flux

Thermal Design of a DWDM Optical Network System

W. Mark Hendrix

IMECE 2005; 349-370doi:https://doi.org/10.1115/IMECE2005-81704

Abstract

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Topics: Design , Reliability , Density , Cooling , Noise (Sound) , Telecommunications , Temperature , Traffic

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

M. Chin, S. J. Hu, J. R. Barber

IMECE 2005; 371-374doi:https://doi.org/10.1115/IMECE2005-81892

Abstract

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Topics: Adhesion , Adhesives , Anisotropy , Bonding , Contact resistance , Delamination , Design , Microelectronic packaging

An Yield Model for Electronics Assembly

N. Gnanasambandam, M. Munikrishnan, V. Poyyapakkam, P. Borgesen, K. Srihari

IMECE 2005; 375-380doi:https://doi.org/10.1115/IMECE2005-82623

Abstract

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Topics: Electronics , Manufacturing , Modeling , Ball-Grid-Array packaging , Density , Design , Electronic components , Flip-chip , Flip-chip devices , Microelectronic devices

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari

IMECE 2005; 381-390doi:https://doi.org/10.1115/IMECE2005-83021

Abstract

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Topics: Adhesives , Anisotropy , Manufacturing , Surface mount packaging , Temperature

A Repeatable and Reliable Rework Process for Lead-Free Fine Pitch BGA’s

Deepak Manjunath, Satyanarayan Iyer, Shawn Eckel, Purushothaman Damodaran, Krishnaswami Srihari

IMECE 2005; 391-397doi:https://doi.org/10.1115/IMECE2005-83026

Abstract

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Topics: Ball-Grid-Array packaging , Copper , Forced convection , Iron , Lead-free solders , Machinery , Ovens , Reliability , Solder joints , Soldering

A Study on Optical Fiber Damage Due to Optoelectronic Assembly Processes

Kaustubh R. Nagarkar, Peter Borgesen, Krishnaswami Srihari

IMECE 2005; 399-405doi:https://doi.org/10.1115/IMECE2005-83030

Abstract

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Topics: Damage , Manufacturing , Optical fiber , Fibers , Equipment performance , Adhesives , Lasers , Optical microscopy , Packaging , Photodiodes

Polymer Tube Embedded In-Plane Micropump: Design, Analysis and Fabrication

Ashutosh Kole, Jeongsik Sin, Woo Ho Lee, Danq Popaq, Dereje Agonafer, Harry E. Stephanou

IMECE 2005; 407-413doi:https://doi.org/10.1115/IMECE2005-83172

Abstract

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Topics: Actuators , Design , Manufacturing , Micropumps , Polymers

Nanoscale Phenomenon in Microelectronics

Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection

John G. Bai, Zach Z. Zhang, Jesus N. Calata, Guo-Quan Lu

IMECE 2005; 415-424doi:https://doi.org/10.1115/IMECE2005-79187

Abstract

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Topics: Low temperature , Nanoscale phenomena , Silver , Sintering

Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface

Anand Desai, James Geer, Bahgat Sammakia

IMECE 2005; 425-431doi:https://doi.org/10.1115/IMECE2005-79732

Abstract

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Topics: Carbon , Carbon nanotubes , Cylinders , Electrical measurement , Energy dissipation , Flat heat pipes , Geometry , Heat conduction , Heat sinks , Modeling

Nano-Imprint Patterning of Nanowire Structures for Interconnect Study

Bin Li, Anastassios Mavrokefalos, Jianhua Zhou, Li Shi, Paul S. Ho, Joshua Zide, Arthur C. Gossard

IMECE 2005; 433-437doi:https://doi.org/10.1115/IMECE2005-82644

Abstract

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Topics: Nanowires

Thermal Management for Microelectronics

Cooling System for a Portable Bio-Industry Centrifuge

Shahla Vatannia, Fred Barez

IMECE 2005; 439-458doi:https://doi.org/10.1115/IMECE2005-79096

Abstract

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Topics: Computational fluid dynamics , Cooling systems , Rotors , Temperature , Heat , Blood , Computer cooling , Computer simulation , Electronics , Engines

Thermal Needs and Challenges for the Solid State Lighting Devices: Materials to Packages

Mehmet Arik, Stanton Weaver, Anant Setlur, Deborah Haitko

IMECE 2005; 459-466doi:https://doi.org/10.1115/IMECE2005-79330

Abstract

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Topics: Architecture , Brightness (Photometry) , Electric current , Electronic packaging , Fillers (Materials) , Flux (Metallurgy) , Heat , Heat flux , Light-emitting diodes , Packaging

Heat Conduction in Three Dimensional Stacked Packages

Anand Desai, James Geer, Bahgat Sammakia

IMECE 2005; 467-472doi:https://doi.org/10.1115/IMECE2005-79771

Abstract

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Topics: Heat conduction , Thermal management , Geometry , Heat , Carbon nanotubes , Cooling , Modeling , Steady state , Thermal conductivity

Characterization and Analysis of Low Profile Plate-Fin Heat Sinks for Advanced Thermal Packaging of Consumer Electronics

K. Yazawa, T. Yoshida, S. Nakagawa, M. Ishizuka

IMECE 2005; 473-479doi:https://doi.org/10.1115/IMECE2005-79806

Abstract

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Topics: Electronics , Heat sinks , Packaging , Cooling , Design , Fluids , Air flow , Density , Fins , Numerical analysis

Convective Heat Transfer From a Stationary or Rotating MCM Disk With a Unconfined Round Jet Impingement

Y. M. Kuo, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung

IMECE 2005; 481-488doi:https://doi.org/10.1115/IMECE2005-80011

Abstract

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Topics: Convection , Disks , Transients (Dynamics) , Steady state , Heat transfer , Mixed convection , Buoyancy , Reynolds number , Rotation , Fluid dynamics

Lattice Boltzmann Modeling of the Thermal Response of Silicon-On-Insulator Transistors Under Joule Heating Including Phonon Dispersion

Rodrigo A. Escobar, Cristina H. Amon

IMECE 2005; 489-499doi:https://doi.org/10.1115/IMECE2005-80025

Abstract

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Topics: Heating , Joules , Lattice Boltzmann methods , Modeling , Phonons , Silicon-on-insulator , Transistors , Simulation , Temperature , Diffusion (Physics)

Liquid Metal Based Miniaturized Chip-Cooling Device Driven by Electromagnetic Pump

Jing Liu, Yi-Xin Zhou, Yong-Gang Lv, Teng Li

IMECE 2005; 501-510doi:https://doi.org/10.1115/IMECE2005-80188

Abstract

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Topics: Cooling , Liquid metals , Pumps , Heat , Energy dissipation , Flow (Dynamics) , Electromagnetic fields , Engineering prototypes , Fluids , Gallium

Numerical Evaluation on the Heat Dissipation Capability of Liquid Metal Based Chip Cooling Device

Zhong-Shan Deng, Jing Liu

IMECE 2005; 511-515doi:https://doi.org/10.1115/IMECE2005-80189

Abstract

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Topics: Cooling , Energy dissipation , Heat , Liquid metals , Thermal management , Flow (Dynamics) , Heat transfer , Water

Thermal Optimal Design for Multichip Module Disks With an Unconfined Round-Jet Impingement

C. J. Fang, M. C. Wu, C. H. Peng, Y. C. Lee, Y. H. Hung

IMECE 2005; 517-524doi:https://doi.org/10.1115/IMECE2005-81066

Abstract

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Topics: Design , Disks , Multi-chip modules , Reynolds number , Optimization , Steady state , Transients (Dynamics) , Composite materials , Nozzles , Quadratic programming

Estimation of Anisotropic Thermal Conductivity in Nanoscale Confined Semiconductors via Lattice Boltzmann Method

Sartaj S. Ghai, Woo Tae Kim, Cristina H. Amon, Myung S. Jhon

IMECE 2005; 525-529doi:https://doi.org/10.1115/IMECE2005-81232

Abstract

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Topics: Anisotropy , Lattice Boltzmann methods , Nanoscale phenomena , Semiconductors (Materials) , Thermal conductivity , Boundary-value problems , Geometry , Mean free path , Semiconductor films , Solids

Design of a Cold Plate Tester for Accurate Measurement of Thermal Performance

Nikhil Lakhkar, Madhusudan Iyengar, Michael Ellsworth, Jr., Dereje Agonafer

IMECE 2005; 531-539doi:https://doi.org/10.1115/IMECE2005-81553

Abstract

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Topics: Design , Uncertainty analysis , Errors , Plates (structures) , Thermal resistance , Computers , Energy dissipation , Heat , Heat flux , Heat sinks

SprayCool™ Thermal Management for Dense Stacked Memory

Tahir Cader, Ben Tollman, Cai Kabrell, Sridhar Krishnan

IMECE 2005; 541-548doi:https://doi.org/10.1115/IMECE2005-81692

Abstract

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Topics: Computational fluid dynamics , Density , Design , Engineering simulation , Evaporative cooling , Failure , Fluids , Heat transfer coefficients , Junctions , Plasma spraying

Thermal Performance Prediction for High Power Processors at High Altitude

Guoping Xu

IMECE 2005; 549-554doi:https://doi.org/10.1115/IMECE2005-82424

Abstract

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Topics: Air flow , Computer cooling , Electronic components , Electronic systems , Flow (Dynamics) , Fluid dynamics , Forced convection , Heat sinks , Heat transfer , Pressure drop

Thermal Design and Optimization of an IGBT Power Electronic Module

Manu Mital, Elaine P. Scott

IMECE 2005; 555-559doi:https://doi.org/10.1115/IMECE2005-83058

Abstract

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Topics: Design , Optimization

Integration and Packaging of Micro/Nano/Electronic Systems

Materials for MEMS/NEMS

Nano-Scale Abrasion Studies of Materials Used in MEMS Devices and Packages

Jong M. Park, Senol Mutlu, Yogesh B. Gianchandani

IMECE 2005; 563-567doi:https://doi.org/10.1115/IMECE2005-80490

Abstract

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Topics: Abrasion , Microelectromechanical systems , Nanoscale phenomena , Glass , Ceramics , Diamonds , Fluidic devices , Manufacturing , Silicon

Low Cost Metal Mini-Cap Process for Suspended MEMS Device Packaging

Wei Chung, Leonardo Wang, W. Fang

IMECE 2005; 569-574doi:https://doi.org/10.1115/IMECE2005-82505

Abstract

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Topics: Metals , Microelectromechanical systems , Packaging , Semiconductor wafers , Bonding , Manufacturing , Design , Etching , Molding , Solders

Nanotechnology

The Effects of Process Parameters on Carbon Nanotube Synthesis by Plasma Enhanced Chemical Vapor Deposition (PECVD)

Sungwon S. Kim, Timothy S. Fisher

IMECE 2005; 575-580doi:https://doi.org/10.1115/IMECE2005-81431

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Topics: Carbon nanotubes , Plasma-enhanced chemical vapor deposition , Carbon , Bonding , Catalysts , Film thickness , Flow (Dynamics) , Methane , Microwaves , Nanostructures

Tailored Nanoscale Contrast Agents for Magnetic Resonance Imaging

Alex J. Barker, Brant Cage, Stephen Russek, Ruchira Garg, Robin Shandas, Conrad R. Stoldt

IMECE 2005; 581-590doi:https://doi.org/10.1115/IMECE2005-81503

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Topics: Magnetic resonance imaging , Nanoscale phenomena , Nanocrystals , Superconducting quantum interference devices , Anisotropy , Imaging , Magnetization , Magnets , Nanoparticles , Crystals

Nanoscale Measurements of Coupled Mechanical Electrical and Thermal Properties Using a Novel Characterization Tool

Utkarsha Singh, Alexis Abramson, Vikas Prakash

IMECE 2005; 591-598doi:https://doi.org/10.1115/IMECE2005-82861

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Topics: Actuators , Design , Displacement measurement , Imaging , Nanoscale phenomena , Nanostructures , Probes , Scanning electron microscopes , Testing , Thermal properties

Non-Standard MEMS

Fabrication of Inkjet Printed Flexible Electronics by Low Temperature Subtractive Laser Processing

Seung Hwan Ko, Jaewon Chung, Yeonho Choi, Costas P. Griogoropoulos, Dimos Poulikakos

IMECE 2005; 599-603doi:https://doi.org/10.1115/IMECE2005-80535

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Topics: Flexible electronics , Lasers , Low temperature , Manufacturing , Nanoparticles , Capacitors , Electrical components , Laser beams , Polymers , Electrical resistivity

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Integration and Packaging of Micro/Nano/Electronic Systems

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Nanotechnology

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