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Proceedings Papers

Finite Element Modeling and Photoelastic Analysis of an Integral Armor Under Flexural Loading

H. Mahfuz, B. R. Lokesh, P. S. Das, U. Vaidya, S. Jeelani

Proc. ASME. IMECE97, Noise Control and Acoustics, 235-241, November 16–21, 1997

Paper No: IMECE1997-1049

DOI: https://doi.org/10.1115/IMECE1997-1049

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Topics: Armor, Finite element analysis, Modeling, Bricks, Coating processes, Coatings, Composite materials, Deformation, Diffraction patterns, Failure mechanisms

Proceedings Papers

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

Waldyr L. R. Gallo, Jorge Llagostera, Arnaldo C. S. Walter

Proc. ASME. IMECE97, Advanced Energy Systems, 231-238, November 16–21, 1997

Paper No: IMECE1997-0993

DOI: https://doi.org/10.1115/IMECE1997-0993

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Topics: Cycles, Fuels, Thermoeconomics, Water, Compressors, Pressure, Alloys, Blades, Cooling, Economic analysis

Proceedings Papers

A Thermodynamic Analysis of Fever in Chemotraphs

K. Annamalai, T. Morris, D. McNichols

Proc. ASME. IMECE97, Advanced Energy Systems, 239-247, November 16–21, 1997

Paper No: IMECE1997-0994

DOI: https://doi.org/10.1115/IMECE1997-0994

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Topics: Blood flow, Combustion, Energy levels (Quantum mechanics), Exhaust systems, Food products, Heat, Heat losses, Oxidation, Skin, Sleep

Proceedings Papers

Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage

Salvador M. Aceves, Gene D. Berry

Proc. ASME. IMECE97, Advanced Energy Systems, 155-163, November 16–21, 1997

Paper No: IMECE1997-0985

DOI: https://doi.org/10.1115/IMECE1997-0985

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Topics: Hydrogen storage, Pressure vessels, Thermodynamics, Hydrogen, Temperature, Vessels, Automobiles, Fuels, Low temperature, Pressure

Proceedings Papers

Pool Boiling Heat Transfer Coefficients of Alternative Refrigerants

Dongsoo Jung, Chong-Bo Kim, Kil-Hong Song, Jun-Kang Lee

Proc. ASME. IMECE97, Advanced Energy Systems, 411-415, November 16–21, 1997

Paper No: IMECE1997-1014

DOI: https://doi.org/10.1115/IMECE1997-1014

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Topics: Heat transfer coefficients, Pool boiling, Refrigerants, Copper, Heat flux, Heat transfer, Nucleate pool boiling, Temperature

Proceedings Papers

Thermionic Cascade Converter Concept for High-Efficiency Space Power

Lester L. Begg, Thomas H. Van Hagan, Joe N. Smith, Jr.

Proc. ASME. IMECE97, Advanced Energy Systems, 59-63, November 16–21, 1997

Paper No: IMECE1997-0974

DOI: https://doi.org/10.1115/IMECE1997-0974

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Topics: Cascades (Fluid dynamics), Heat, Energy conversion, Temperature, Solar energy, Belts, Databases, Power systems (Machinery)

Proceedings Papers

An Analysis of the Major Variables Impacting Performance of Absorption Chillers and Heat Pumps

Keith E. Herold

Proc. ASME. IMECE97, Advanced Energy Systems, 349-356, November 16–21, 1997

Paper No: IMECE1997-1007

DOI: https://doi.org/10.1115/IMECE1997-1007

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Topics: Absorption, Heat pumps, Heat, Temperature, Cycles, Machinery, Heat transfer, Machine design, Modeling, Shapes

Proceedings Papers

150 Watt Portable Thermophotovoltaic Power Supply

Frederick E. Becker, Edward F. Doyle, Kailash C. Shukla

Proc. ASME. IMECE97, Advanced Energy Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-0975

DOI: https://doi.org/10.1115/IMECE1997-0975

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Topics: Ceramics, Defense industry, Design, Electricity (Physics), Energy conversion, Energy gap, Energy generation, Energy recovery, Engineering prototypes, Engines

Proceedings Papers

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

C. Steve Suh, G. Andrew Rabroker, Christian P. Burger, Ravinder Chona

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 37-43, November 16–21, 1997

Paper No: IMECE1997-1225

DOI: https://doi.org/10.1115/IMECE1997-1225

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Topics: Semiconductor wafers, Temperature, Waves, Acoustics, Fibers, Interferometers, Mechanical properties, Nondestructive evaluation, Splines, Thermomechanics

Proceedings Papers

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Y. Zou, J. C. Suhling, R. C. Jaeger, S. T. Lin, L. Nguyen, S. A. Gee

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 15-21, November 16–21, 1997

Paper No: IMECE1997-1222

DOI: https://doi.org/10.1115/IMECE1997-1222

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Topics: Silicon, Stress, Finite element analysis, Temperature, Constitutive equations, Electronic packaging, Engineering simulation, Packaging, Sensors, Shear stress

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997

Paper No: IMECE1997-1227

DOI: https://doi.org/10.1115/IMECE1997-1227

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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation

Proceedings Papers

Analytical Feasibility of Laser Induced Stress Wave Thermometry Applied to Silicon Wafers

G. Andrew Rabroker, C. Steve Suh, Christian P. Burger, Ravinder Chona

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 45-50, November 16–21, 1997

Paper No: IMECE1997-1226

DOI: https://doi.org/10.1115/IMECE1997-1226

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Topics: Lasers, Semiconductor wafers, Stress, Temperature measurement, Waves, Temperature, Anisotropy, Dispersion relations, Elastic constants, Rapid thermal processing

Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997

Paper No: IMECE1997-1228

DOI: https://doi.org/10.1115/IMECE1997-1228

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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature

Proceedings Papers

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Chang J. Park, Deborah A. Kaminski

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 99-108, November 16–21, 1997

Paper No: IMECE1997-1219

DOI: https://doi.org/10.1115/IMECE1997-1219

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Topics: Bolted joints, Contact resistance, Plates (structures), Boundary-value problems, Copper, Pressure, Cooling, Design, Finishes, Geometry

Proceedings Papers

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

K. Ramakrishna, J. R. Trent

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 13-21, November 16–21, 1997

Paper No: IMECE1997-1210

DOI: https://doi.org/10.1115/IMECE1997-1210

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Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation

Proceedings Papers

The Recommended Geometry for Laminar Microchannel Heat Sinks

Jeffrey J. Lienau

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 47-54, November 16–21, 1997

Paper No: IMECE1997-1213

DOI: https://doi.org/10.1115/IMECE1997-1213

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Topics: Geometry, Heat sinks, Microchannels, Design, Coolants, Cooling, Heat flux, Heat transfer, Integrated circuits, Optical instruments

Proceedings Papers

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-1215

DOI: https://doi.org/10.1115/IMECE1997-1215

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Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability

Proceedings Papers

Experimental Study of Automotive Brake System Temperatures

A. F. Emery, P. Kumar, J. C. Firey

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 55-64, November 16–21, 1997

Paper No: IMECE1997-1214

DOI: https://doi.org/10.1115/IMECE1997-1214

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Topics: Automotive brakes, Temperature, Brakes, Braking, Fluids, Boiling, Disks, Vehicles, Energy dissipation, Failure

Proceedings Papers

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

Andrew J. Scholand, Russell S. Peak, Robert E. Fulton

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 23-31, November 16–21, 1997

Paper No: IMECE1997-1211

DOI: https://doi.org/10.1115/IMECE1997-1211

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Topics: Electronic packaging, Manufacturing, Printed circuit boards, Product quality, Warping, Ovens, Economics , Materials properties, Temperature, Thermomechanics

2 3 4 5

NARROW

Finite Element Modeling and Photoelastic Analysis of an Integral Armor Under Flexural Loading

Hat Cycle Exergetic Analysis and Thermoeconomic Evaluation of Fuel Costs

A Thermodynamic Analysis of Fever in Chemotraphs

Thermodynamics of Insulated Pressure Vessels for Vehicular Hydrogen Storage

Pool Boiling Heat Transfer Coefficients of Alternative Refrigerants

Thermionic Cascade Converter Concept for High-Efficiency Space Power

An Analysis of the Major Variables Impacting Performance of Absorption Chillers and Heat Pumps

150 Watt Portable Thermophotovoltaic Power Supply

Ultrasonic Time-Frequency Characterization of Silicon Wafers at Elevated Temperatures

Characterization of Plastic Packages Using (100) Silicon Stress Test Chips

Advances in Stress Test Chips

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Analytical Feasibility of Laser Induced Stress Wave Thermometry Applied to Silicon Wafers

Evaluation of Die Stress Using van der Pauw Sensors

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Parametric Study of Thermal Performance of a Plastic Ball Grid Array, Single Package Technology for Automotive Applications

The Recommended Geometry for Laminar Microchannel Heat Sinks

Transient Thermal Analysis of Outdoor Electronic Equipment

Experimental Study of Automotive Brake System Temperatures

Improving Electronic Packaging Manufacturing Through Product and Process-Driven Analysis: A PWB Case Study

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