Growth Mechanism of Subsurface Crack Due to Hertzian Contact

[+] Author and Article Information
M. Kaneta, T. Okazaki

Department of Mechanical Engineering, Kyushu Institute of Technology, Sensui-cho, Tobata, Kitakyushu, 804, Japan

Y. Murakami

Department of Mechanics and Strength of Solids, Kyushu University, Hakozaki, Fukuoka, 812, Japan

J. Tribol 108(1), 134-139 (Jan 01, 1986) (6 pages) doi:10.1115/1.3261133 History: Received January 18, 1985; Online October 29, 2009


The variations of three-dimensional mixed mode stress intensity factors for a circular crack under a Hertzian contact pressure moving over the surface are calculated by taking into account both the frictional forces between the crack faces and between the contact surfaces. The circular (penny shaped) crack is assumed to be embeded parallel to the surface. The crack opening occurs near the leading crack tip as well as near the trailing crack tip depending on the pass of the contact load. The crack propagates mainly Mode II, though application of a high surface traction or a heavy contact load can induce the tensile mode crack growth. When the surface traction is directed from left to right, the left side crack tip propagates parallel to the surface and the right side crack tip extends toward the surface.

Copyright © 1986 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In