Rheological Models for Stick-Slip Behavior

[+] Author and Article Information
Siyoul Jang, John Tichy

Department of Mechanical Engineering, Aeronautical Engineering & Mechanics, Rensselaer Polytechnic Institute, Troy, NY 12180-3590

J. Tribol 119(4), 626-631 (Oct 01, 1997) (6 pages) doi:10.1115/1.2833861 History: Received February 22, 1996; Revised July 08, 1996; Online January 24, 2008


Stick-slip is a complex phenomenon which has been studied by researchers from many points of view. A variety of engineering factors, such as surface roughness, may contribute to this behavior. However, recent studies from basic science have shown that molecularly smooth surfaces separated by a film also exhibit stick-slip. Thus, the process may be intrinsically film-induced due to transitions between solid-like and fluid-like behavior. The authors of such studies often state that this kind of response indicates the futility of trying to describe such behavior from a continuum perspective. A purpose of this paper is to refute that point of view. Other studies, both experimental and theoretical, have indicated that continuum rheological models may be valid for films of molecular (nanometer) scale. Various rheological models which can predict stick-slip are proposed in this paper. Calculated results are similar to those of experiment.

Copyright © 1997 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In