Wear Mechanisms at the Metal Evaporated Magnetic Tape-Head Interface

[+] Author and Article Information
Pascal Berar, Koji Kato

Laboratory of Tribology, School of Mechanical Engineering, Tohoku University, Sendai, 980, Japan

Hiroyuki Osaki

Sony Corporation Sendai Technology Center, 3-4-1 Sakurai, Tagajo 985, Japan

Toshiyuki Terazono

Bridgestone Corporation, 3-1-1, Ogawahigashi-cho, Kodaira-shi, Tokyo 187, Japan

Philippe Kapsa

CNRS Research Director, Laboratoire de Tribologie et Dynamique des Systèmes, UMR CNRS 5513, Ecole Centrale de Lyon, BP 163, 69131 Ecully, Cedex, France

J. Tribol 121(2), 408-415 (Apr 01, 1999) (8 pages) doi:10.1115/1.2833954 History: Received August 23, 1994; Revised April 05, 1997; Online January 24, 2008


The wear mechanisms of Metal-Evaporated magnetic tape-head interfaces have been investigated. A new apparatus was designed for the continuous observation of the tape surface when run in the still frame mode. The mild wear mechanism of the bumps on the ME tapes was proven using SEM and AFM. Four different types of wear debris were observed. Depending on wear debris formation, two types of spalling were emphasized. The effect of humidity in the range of 30–70 percent was also investigated. The wear mechanisms are discussed in terms of contact mechanics theory, coating failure modes, and humidity induced stiction theory.

Copyright © 1999 by The American Society of Mechanical Engineers
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