Pad Soaking Effect on Interfacial Fluid Pressure Measurements During CMP

[+] Author and Article Information
Sum Huan Ng, Robert Hight, Chunhong Zhou, Inho Yoon, Steven Danyluk

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Tribol 125(3), 582-586 (Jun 19, 2003) (5 pages) doi:10.1115/1.1538632 History: Received February 27, 2002; Revised October 03, 2002; Online June 19, 2003
Copyright © 2003 by ASME
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Schematic diagram of the polishing and pressure measurement apparatus
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Pad weight (percent) versus soaking time (hrs) for Rodel IC1000 pad
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Weight increase (percent) versus soaking time (hrs) for different size pads
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Comparison of normalized weight increase with volume and dimension of different size pads (mm)
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Low magnification optical micrograph of a cross sectional view of pad soaked in black ink
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High magnification optical micrograph of a cross sectional view of pad soaked in black ink
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Optical micrograph of the surface of the pad showing interconnected pores linked both laterally and into the pad
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Elastic modulus of IC1000 pad versus soaking time
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Interfacial fluid pressure (kPa) versus sensor position for different pad soaking time
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Maximum interfacial fluid pressure (kPa) versus pad soaking time (hrs) for a load of 14.15 kPa and platen speed of 100 rpm
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Interfacial fluid pressure (kPa) (at v=0.15 m/s) versus location predicted by the model for different pad elastic moduli



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