A Material Removal Rate Model Considering Interfacial Micro-Contact Wear Behavior for Chemical Mechanical Polishing

[+] Author and Article Information
Yeau-Ren Jeng, Pay-Yau Huang

Department of Mechanical Engineering, National Chung Cheng University, 160 San-Hsing, Ming-Hsiung, Chia-Yi 621, Taiwan

J. Tribol 127(1), 190-197 (Feb 07, 2005) (8 pages) doi:10.1115/1.1828068 History: Received December 02, 2003; Revised June 03, 2004; Online February 07, 2005
Copyright © 2005 by ASME
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Grahic Jump Location
Schematic diagram of CMP platform
Grahic Jump Location
Schematic view of real contact area between polishing interfaces
Grahic Jump Location
Schematic view of abrasive particles trapped at the top of the polishing pad asperities
Grahic Jump Location
Effective abrasive particles in the polishing interface
Grahic Jump Location
Comparison of normalized predicted material removal rate with experimental results of Bielmann et al.
Grahic Jump Location
(a) Variation in material removal rate with down force for different average particle sizes. (b) Variation in number of effective particles with average particle size for different magnitudes of applied down force. (c) Variation in separation distance with magnitude of down force for different average particle sizes.
Grahic Jump Location
(a) Variation in material removal rate with magnitude of down force for different values of wafer surface hardness. (b) Variation in number of effective particles with magnitude of down force for different values of wafer surface hardness. (c) Variation in separation distance with magnitude of down force for different values of wafer surface hardness.
Grahic Jump Location
Variation in material removal rate with slurry concentration



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