An Analysis of Mixed Lubrication in Chemical Mechanical Polishing

[+] Author and Article Information
Sum Huan Ng, C. Fred Higgs

Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA 15213

Inho Yoon, Steven Danyluk

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Tribol 127(2), 287-292 (Apr 07, 2005) (6 pages) doi:10.1115/1.1760551 History: Received July 29, 2003; Revised February 04, 2004; Online April 07, 2005
Copyright © 2005 by ASME
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Shan, L., Levert, J. L., and Danyluk, S., 1998, “Pressure Distribution at the Silicon/Polishing Pad Interface,” Proceedings of ASPE Spring Topical Meeting on Silicon Machining, pp. 96–100.
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Patir,  N., and Cheng,  H. S., 1979, “Application of Average Flow Model to Lubrication between Rough Sliding Surfaces,” ASME J. Lubr. Technol., 101, pp. 12–17.
Shan,  L., Levert,  J. L., Meade,  L., Tichy,  J. A., and Danyluk,  S., 2000, “Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing,” ASME J. Tribol., 122(3), pp. 539–543.
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Schematic diagram of the polishing and pressure measurement apparatus
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Distribution of surface heights of pads: (a) as-received pad; and (b) conditioned pad.
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One-dimensional surface profile of pads: (a) as-received pad; and (b) conditioned pad.
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Scanning electron micrographs of pads: (a) as-received pad; and (b) conditioned pad.
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Scan procedure and Peklenik number of pad
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Autocorrelation functions from a pair of profilometric scans
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Variance ratios for shear flow factor: (a) rough surface moving, Vr1=1; and (b) smooth surface moving, Vr1=0.
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Pressure variation and cavitation in a variable area pipe 11
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Effect of Poisson’s ratio
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Effect of friction coefficient
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Effect of pad roughness



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