To investigate the effect of stencil thickness and reflow ambient atmosphere on the reliability of ceramic ball grid array (CBGA) assemblies, three levels of stencil thickness, 0.10, 0.15, and 0.20 mm, were used to print solder paste on printed circuit board (PCB). After the CBGA modules were placed on PCBs, the specimens were divided into two groups, and reflowed in nitrogen and compressed air separately. Properties of the six groups of assemblies, such as shear strength, bending fatigue life, thermal shock cycles, and vibration fatigue life, were tested to find out the optimum assembling process. The results show that assemblies prepared with a stencil 0.15 mm thick yield maximized performance. And the nitrogen ambient atmosphere demonstrates a remarkable effect on improving the fatigue life. Theoretical models are given to qualitatively explain the relationship between the solder joint volume and performance. This work provides a guideline on how to determine the soldering process parameters of CBGA assemblies.
Skip Nav Destination
e-mail: eeycchan@cityu.edu.hk
Article navigation
September 2001
Papers On Reliability
The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies
Y. P. Wu,
Y. P. Wu
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong
Search for other works by this author on:
P. L. Tu,
P. L. Tu
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong
Search for other works by this author on:
Yan C. Chan
e-mail: eeycchan@cityu.edu.hk
Yan C. Chan
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong
Search for other works by this author on:
Y. P. Wu
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong
P. L. Tu
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong
Yan C. Chan
Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong
e-mail: eeycchan@cityu.edu.hk
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD July 7, 1999. Associate Editor: S. M. Heinrich.
J. Electron. Packag. Sep 2001, 123(3): 284-289 (6 pages)
Published Online: July 7, 1999
Article history
Received:
July 7, 1999
Citation
Wu , Y. P., Tu , P. L., and Chan, Y. C. (July 7, 1999). "The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies ." ASME. J. Electron. Packag. September 2001; 123(3): 284–289. https://doi.org/10.1115/1.1371782
Download citation file:
Get Email Alerts
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
J. Electron. Packag (September,2003)
Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
J. Electron. Packag (September,2005)
Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds
J. Electron. Packag (September,2001)
Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
J. Electron. Packag (December,2005)
Related Proceedings Papers
Related Chapters
Research on Strengthening Mechanism of Plant Root in Slope Protection
Geological Engineering: Proceedings of the 1 st International Conference (ICGE 2007)
Engineering Design about Electro-Hydraulic Intelligent Control System of Multi Axle Vehicle Suspension
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)
Numerical Test Research on the Shear Strength Parameters of Rock Joints Based on the Fractal Theory
Geological Engineering: Proceedings of the 1 st International Conference (ICGE 2007)