We demonstrate the lid-integral silicon cold-plate topology as a way to bring liquid cooling closer to the heat source integrated circuit (IC). It allows us to eliminate one thermal interface material (TIM2), to establish and improve TIM1 during packaging, to use wafer-level processes, and to ease integration in first-level packaging. We describe the integration and analyze the reliability aspects of this package using modeling and test vehicles. To compare the impact of geometry, materials, and mechanical coupling on warpage, strains, and stresses, we simulate finite element models of five different topologies on an organic land-grid array (LGA) carrier. We measure the thermal performance in terms of thermal resistance from cold-plate base to inlet liquid and obtain 15 mm2 K/W at 30 kPa pressure drop across the package. We build two different topologies using silicon cold-plates and injection-molded lids. Gasket-attached cold-plates pass an 800 kPa pressure test, and direct-attached cold-plates fracture in the cold-plate. The results advise to use a compliant layer between cold-plate and manifold lid and promise a uniformly thick TIM1 layer in the Si–Si matched topology. The work shows the feasibility of composite lids with integrated silicon cold-plates in high heat flux applications.
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March 2016
Research-Article
Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
Marco de Fazio,
Marco de Fazio
Advanced System Technology,
ST Microelectronics,
Burlington, MA 01803
ST Microelectronics,
Burlington, MA 01803
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Werner Escher,
Werner Escher
IBM Research–Zurich,
Rüschlikon 8803, Switzerland
Rüschlikon 8803, Switzerland
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Paola Granatieri,
Paola Granatieri
Custom MEMS Division,
ST Microelectronics,
Agrate Brianza 20864, MB, Italy
ST Microelectronics,
Agrate Brianza 20864, MB, Italy
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Vijayeshwar D. Khanna,
Vijayeshwar D. Khanna
IBM Research–T.J. Watson Research Center,
Yorktown Heights, NY 10598
Yorktown Heights, NY 10598
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Thomas Brunschwiler
Thomas Brunschwiler
IBM Research–Zurich,
Rüschlikon 8803, Switzerland
Rüschlikon 8803, Switzerland
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Gerd Schlottig
Marco de Fazio
Advanced System Technology,
ST Microelectronics,
Burlington, MA 01803
ST Microelectronics,
Burlington, MA 01803
Werner Escher
IBM Research–Zurich,
Rüschlikon 8803, Switzerland
Rüschlikon 8803, Switzerland
Paola Granatieri
Custom MEMS Division,
ST Microelectronics,
Agrate Brianza 20864, MB, Italy
ST Microelectronics,
Agrate Brianza 20864, MB, Italy
Vijayeshwar D. Khanna
IBM Research–T.J. Watson Research Center,
Yorktown Heights, NY 10598
Yorktown Heights, NY 10598
Thomas Brunschwiler
IBM Research–Zurich,
Rüschlikon 8803, Switzerland
Rüschlikon 8803, Switzerland
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 25, 2015; final manuscript received January 8, 2016; published online March 10, 2016. Assoc. Editor: Toru Ikeda.
J. Electron. Packag. Mar 2016, 138(1): 010906 (7 pages)
Published Online: March 10, 2016
Article history
Received:
September 25, 2015
Revised:
January 8, 2016
Citation
Schlottig, G., de Fazio, M., Escher, W., Granatieri, P., Khanna, V. D., and Brunschwiler, T. (March 10, 2016). "Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability." ASME. J. Electron. Packag. March 2016; 138(1): 010906. https://doi.org/10.1115/1.4032493
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