The purpose of this paper is to demonstrate the possibility to selectively tune the convective heat transfer coefficient in different sections of a heat sink by varying the density of microfeatures in order to minimize temperature gradients between discrete heat sources positioned along the flow path. Lifetime of power electronics is strongly correlated to the thermal management of the junction. Therefore, it is of interest to have constant junction temperatures across all devices in the array. Implementation of microfeature enhancement on the convective side improves the heat transfer due to an increase in surface area. Specific shapes such as micro-hydrofoils offer a reduced pressure drop allowing for combined improvement of heat transfer and flow performance. This study presents experimental results from an array of three discrete heat sources (20 × 15 mm) generating 100 W/cm2 and positioned in line along the flow path with a spacing of 10 mm between each of the sources. The heat sink was machined out of aluminum 6061, and micro-hydrofoils with a characteristic length of 500 μm were embedded in the cold plate. The cooling medium used is water at a flow rate of 3.6–13.4 g/s corresponding to a Reynolds number of 420–1575. It is demonstrated that the baseplate temperature can be maintained below 90 °C, and the difference between the maximum temperatures of each heat source is less than 6.7 °C at a heat flux of 100 W/cm2 and a water flow rate of 4.8 g/s.
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March 2016
Research-Article
Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation
Noris Gallandat,
Noris Gallandat
The George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
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Danielle Hesse,
Danielle Hesse
The George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Search for other works by this author on:
J. Rhett Mayor
J. Rhett Mayor
Associate Professor
Mem. ASME
The George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: rhett.mayor@me.gatech.edu
Mem. ASME
The George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: rhett.mayor@me.gatech.edu
Search for other works by this author on:
Noris Gallandat
The George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
Danielle Hesse
The George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
J. Rhett Mayor
Associate Professor
Mem. ASME
The George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: rhett.mayor@me.gatech.edu
Mem. ASME
The George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: rhett.mayor@me.gatech.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received September 25, 2015; final manuscript received December 8, 2015; published online March 10, 2016. Assoc. Editor: Xiaobing Luo.
J. Electron. Packag. Mar 2016, 138(1): 010908 (6 pages)
Published Online: March 10, 2016
Article history
Received:
September 25, 2015
Revised:
December 8, 2015
Citation
Gallandat, N., Hesse, D., and Rhett Mayor, J. (March 10, 2016). "Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation." ASME. J. Electron. Packag. March 2016; 138(1): 010908. https://doi.org/10.1115/1.4032347
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