Reactive joining, i.e., utilization of an exothermal reaction to locally generate the heat required for soldering or brazing, represents an emerging technology for flexible and benign joining of heat-sensitive materials, e.g., for microelectromechanical systems (MEMS) applications. However, for successful reactive joining, precise control of heat production and heat distribution is mandatory in order to avoid damaging of the components during the process. For the exemplary case of borosilicate glass, the reactive joining process for a both thermally and mechanically sensitive material is developed. Employing various nondestructive and destructive testing methods, typical problems which can occur upon reactive joining are identified, e.g., exposure of the joining zone to excessive temperatures, experience of thermal shock by the substrate due to sudden temperature increase, and generation of residual stresses in substrate and soldering zone. Utilizing the results of nondestructive and destructive testing, procedures for successful reactive joining of borosilicate glass, silicon and aluminum oxide are provided.
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December 2018
Research-Article
Reactive Joining of Thermally and Mechanically Sensitive Materials
Bastian Rheingans,
Bastian Rheingans
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: bastian.rheingans@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: bastian.rheingans@empa.ch
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Roman Furrer,
Roman Furrer
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: roman.furrer@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: roman.furrer@empa.ch
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Jürg Neuenschwander,
Jürg Neuenschwander
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: juerg.neuenschwander@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: juerg.neuenschwander@empa.ch
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Irina Spies,
Irina Spies
Hahn-Schickard,
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: irina.spies@hahn-schickard.de
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: irina.spies@hahn-schickard.de
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Axel Schumacher,
Axel Schumacher
Hahn-Schickard, Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: axel.schumacher@hahn-schickard.de
Villingen-Schwenningen 78052, Germany
e-mail: axel.schumacher@hahn-schickard.de
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Stephan Knappmann,
Stephan Knappmann
Hahn-Schickard,
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: stephan.knappmann@hahn-schickard.de
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: stephan.knappmann@hahn-schickard.de
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Lars P. H. Jeurgens,
Lars P. H. Jeurgens
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: lars.jeurgens@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: lars.jeurgens@empa.ch
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Jolanta Janczak-Rusch
Jolanta Janczak-Rusch
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: jolanta.janczak@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: jolanta.janczak@empa.ch
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Bastian Rheingans
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: bastian.rheingans@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: bastian.rheingans@empa.ch
Roman Furrer
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: roman.furrer@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: roman.furrer@empa.ch
Jürg Neuenschwander
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: juerg.neuenschwander@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: juerg.neuenschwander@empa.ch
Irina Spies
Hahn-Schickard,
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: irina.spies@hahn-schickard.de
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: irina.spies@hahn-schickard.de
Axel Schumacher
Hahn-Schickard, Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: axel.schumacher@hahn-schickard.de
Villingen-Schwenningen 78052, Germany
e-mail: axel.schumacher@hahn-schickard.de
Stephan Knappmann
Hahn-Schickard,
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: stephan.knappmann@hahn-schickard.de
Wilhelm-Schickard-Strasse 10,
Villingen-Schwenningen 78052, Germany
e-mail: stephan.knappmann@hahn-schickard.de
Lars P. H. Jeurgens
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: lars.jeurgens@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: lars.jeurgens@empa.ch
Jolanta Janczak-Rusch
Empa, Swiss Federal Laboratories for Materials
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: jolanta.janczak@empa.ch
Science and Technology,
Überlandstrasse 129,
Dübendorf 8600, Switzerland
e-mail: jolanta.janczak@empa.ch
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received February 28, 2018; final manuscript received July 20, 2018; published online September 10, 2018. Assoc. Editor: Xiaobing Luo.
J. Electron. Packag. Dec 2018, 140(4): 041006 (8 pages)
Published Online: September 10, 2018
Article history
Received:
February 28, 2018
Revised:
July 20, 2018
Citation
Rheingans, B., Furrer, R., Neuenschwander, J., Spies, I., Schumacher, A., Knappmann, S., Jeurgens, L. P. H., and Janczak-Rusch, J. (September 10, 2018). "Reactive Joining of Thermally and Mechanically Sensitive Materials." ASME. J. Electron. Packag. December 2018; 140(4): 041006. https://doi.org/10.1115/1.4040978
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