Abstract
Solder balls used in electronic packaging should have high dimensional and shape accuracy requirements to ensure the connection quality of solder balls during soldering. However, the existing solder ball detection methods were hard to measure the diameter and roundness in an integrated and fast manner. Therefore, a new method and device for measuring the diameter and roundness of solder balls was proposed based on machine vision technology, including detection device and software design. The experimental device could detect the parameters of at least 40 solder balls at a time. The solder ball image was preprocessed in the software system to improve the quality of the solder ball image, and then the Harris operator successfully detected the concave point on the bonded solder ball image and realized the solder ball separation based on the shortest path matching criterion. Compared with the scanning electron microscope (SEM) measurement value, the diameter and roundness of solder balls measured by the detection system were smaller than 3%.
Issue Section:
Research Papers
References
1.
Yang
,
G.
,
Luo
,
S.
,
Luo
,
B.
,
Zuo
,
Y.
,
Ta
,
S.
,
Lin
,
T.
,
Zhao
,
Z.
,
Zhang
,
Y.
, and
Cui
,
C.
, 2022
, “
The Effects of Pressure, Temperature, and Depth/Diameter Ratio on the Microvia Filling Performance of Ag-Coated Cu Micro-Nanoparticles for Advanced Electronic Packaging
,” Int. J. Smart Nano Mater.
,
13
(4
), pp. 543
–560
.10.1080/19475411.2022.21071142.
Zhang
,
S.
,
Xu
,
X.
,
Lin
,
T.
, and
He
,
P.
, 2019
, “
Recent Advances in Nano-Materials for Packaging of Electronic Devices
,” J. Mater. Sci.: Mater. Electron.
,
30
(15
), pp. 13855
–13868
.10.1007/s10854-019-01790-33.
Lanin
,
V. L.
,
Sergachev
,
I. I.
, and
Khot'kin
,
V. T.
, 2015
, “
Induction Heating of Solder Ball Leads for Assembly of BGA Packages
,” Surf. Eng. Appl. Electrochem.
,
51
(2
), pp. 162
–166
.10.3103/S10683755150200884.
Depiver
,
J. A.
,
Mallik
,
S.
, and
Amalu
,
E. H.
, 2021
, “
Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)
,” J. Electron. Mater.
,
50
(1
), pp. 263
–282
.10.1007/s11664-020-08525-95.
Wang
,
S.
,
Yao
,
Y.
, and
Long
,
X.
, 2019
, “
Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging
,” Appl. Sci.
,
9
(2
), p. 227
.10.3390/app90202276.
Akdeniz
,
C. T.
,
Ölmez
,
Z.
, and
Ölmez
,
T.
, 2020
, “
Detection of BGA Solder Defects From X-Ray Images Using Deep Neural Network
,” Turk. J. Electr. Eng. Comput. Sci.
,
28
(4
), pp. 2020
–2029
.10.3906/elk-1910-1357.
Depiver
,
J. A.
,
Mallik
,
S.
, and
Amalu
,
E. H.
, 2021
, “
Thermal Fatigue Life of Ball Grid Array (BGA) Solder Joints Made From Different Alloy Compositions
,” Eng. Failure Anal.
,
125
, p. 105447
.10.1016/j.engfailanal.2021.1054478.
Park
, Y. S
, Kwon
, Y. M.
, Moon
, J. T.
, Lee
, Y. W.
, Lee
, J. H.
, and Paik
, K. W.
, 2010
, “
Effects of Fine Size Lead-Free Solder Ball on the Interfacial Reactions and Joint Reliability
,” 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC
), Las Vegas, NV, June 1–4, pp. 1436
–1441
.10.1109/ECTC.2010.5490810]9.
Wang
,
T.
,
Lei
,
Y.
,
Zhao
,
P.
,
Lin
,
J.
, and
Fu
,
H.
, 2021
, “
Based on the Technology of Electromagnetic Force Driving and Differential Pressure Control for Producing Solder Balls
,” Mater. Lett.
,
286
, p. 129236
.10.1016/j.matlet.2020.12923610.
Friganiotis
,
I.
, and
Spanos
,
P.
, 2014
, “
On the Control of Micro Ball Grid Array (μBGA) Production Systems
,” WSEAS Trans. Syst. Control
,
9
, pp. 67
–76
.https://wseas.com/journals/articles.php?id=464511.
Wang
,
T.
,
Lin
,
J.
,
Guo
,
X.
,
Lei
,
Y.
, and
Fu
,
H.
, 2018
, “
A New Method for Producing Uniform Droplets by Continuous-Ink-Jet Technology
,” Rev. Sci. Instrum.
,
89
(8
), p. 085008
.10.1063/1.504150312.
Wang
,
T.
,
Lin
,
J.
,
Lei
,
Y.
,
Guo
,
X.
, and
Fu
,
H.
, 2018
, “
Droplets Generator: Formation and Control of Main and Satellite Droplets
,” Colloids Surf., A
,
558
, pp. 303
–312
.10.1016/j.colsurfa.2018.08.04613.
Qin
,
J.
,
Chen
,
Y.
, and
Wang
,
F.
, 2011
, “
Solder Ball Height Measurement by Projection Method
,” IEEE 2011 10th International Conference on Electronic Measurement & Instruments
, Chengdu, Sichuan, Aug. 16–19, Vol.
4
, pp. 101
–106
.10.1109/ICEMI.2011.603795614.
Krastev
,
E.
,
Bernard
,
D.
, and
Nordson
,
D.
, 2010
, “
Modern 2D/3D X-ray Inspection–Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components
,” SMTA Pan Pacific Symposium
, Fremont, CA, Vol.
66
, pp. 1
–6
.https://smtnet.com/library/index.cfm?fuseaction=view_article&article_id=1657&company_id=4899915.
Liu
,
Z.
, and
Qu
,
B.
, 2021
, “
Machine Vision Based Online Detection of PCB Defect
,” Microprocessors Microsyst.
,
82
, p. 103807
.10.1016/j.micpro.2020.10380716.
Jeevitha
,
K.
,
Iyswariya
,
A.
,
RamKumar
,
V.
,
Basha
,
S. M.
, and
Kumar
,
V. P.
, 2020
, “
A Review on Various Segmentation Techniques in Image Processing
,” Eur. J. Mol. Clin. Med.
,
7
, pp. 1342
–1348
.https://ejmcm.com/issue-content/areview-on-various-segmentation-techniques-in-image-processsing-804717.
Yan
,
J.
, and
Piao
,
Y.
, 2015
, “
Research on the Harris Algorithm of Feature Extraction for Moving Targets in the Video
,” Appl. Mech. Mater.
,
741
, pp. 378
–381
.10.4028/www.scientific.net/AMM.741.378Copyright © 2024 by ASME
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