Volume 138 Issue 1 | J. Electron. Packag.

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Volume 138, Issue 1

March 2016

ISSN 1043-7398

EISSN 1528-9044

Editorial

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo

J. Electron. Packag. March 2016, 138(1): 010201. doi: https://doi.org/10.1115/1.4032748

Extract

View articletitled, Special Section on InterPACK 2015

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Topics: Packaging , Thermal analysis , Electronic packaging , Electronics , Microchannels , Fluids , Printed circuit boards

Research Papers

Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Tom Saenen, John R. Thome

J. Electron. Packag. March 2016, 138(1): 010901. doi: https://doi.org/10.1115/1.4032490

Abstract

View articletitled, Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

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Topics: Flow (Dynamics) , Heat conduction , Microchannels , Algorithms , Simulation , Stability

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne

J. Electron. Packag. March 2016, 138(1): 010902. doi: https://doi.org/10.1115/1.4032346

Abstract

View articletitled, Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

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Topics: Energy dissipation , Experimental characterization , Heat transfer , Heating , Thermal conductivity , Thermal resistance , Thermal analysis , Cooling , Temperature , Temperature profiles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

J. Electron. Packag. March 2016, 138(1): 010903. doi: https://doi.org/10.1115/1.4032345

Abstract

View articletitled, A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

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Topics: Calibration , Condensers (steam plant) , Copper , Flat heat pipes , Heat , Heat losses , Natural convection , Temperature , Thermal resistance , Vapors

Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions

Sheikh Mohammad Shavik, Mohammad Nasim Hasan, A. K. M. Monjur Morshed

J. Electron. Packag. March 2016, 138(1): 010904. doi: https://doi.org/10.1115/1.4032463

Abstract

View articletitled, Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions

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Topics: Boiling , Explosives , Molecular dynamics , Simulation , Temperature , Vapors , Wetting , Density , Equilibrium (Physics) , Heat flux

Gas–Liquid Flow Dispersion in Micro-Orifices and Bubble Coalescence With High Flow Rates

A. Tollkötter, F. Reichmann, F. Schirmbeck, J. Wesholowski, N. Kockmann

J. Electron. Packag. March 2016, 138(1): 010905. doi: https://doi.org/10.1115/1.4032557

Abstract

View articletitled, Gas–Liquid Flow Dispersion in Micro-Orifices and Bubble Coalescence With High Flow Rates

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Topics: Bubbles , Flow (Dynamics) , Orifices

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler

J. Electron. Packag. March 2016, 138(1): 010906. doi: https://doi.org/10.1115/1.4032493

Abstract

View articletitled, Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

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Topics: Gaskets , Geometry , Heat , Manifolds , Reliability , Silicon , Stress , Topology , Vehicles , Warping

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. March 2016, 138(1): 010907. doi: https://doi.org/10.1115/1.4032655

Abstract

View articletitled, Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

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Topics: Boiling , Computational fluid dynamics , Flow (Dynamics) , Flux (Metallurgy) , Gallium nitride , Heat conduction , Heat transfer coefficients , Microchannels , Microcoolers , Simulation

Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

Noris Gallandat, Danielle Hesse, J. Rhett Mayor

J. Electron. Packag. March 2016, 138(1): 010908. doi: https://doi.org/10.1115/1.4032347

Abstract

View articletitled, Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

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Topics: Convection , Density , Flow (Dynamics) , Heat , Heat exchangers , Heat transfer , Hydrofoil , Pressure drop , Temperature , Water

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen

J. Electron. Packag. March 2016, 138(1): 010909. doi: https://doi.org/10.1115/1.4032348

Abstract

View articletitled, Modeling Thermal Microspreading Resistance in Via Arrays

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Topics: Boundary-value problems , Convection , Electrical conductivity , Modeling , Thermal conductivity , Heat , Flow (Dynamics) , Finite element model

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

J. Electron. Packag. March 2016, 138(1): 010910. doi: https://doi.org/10.1115/1.4032496

Abstract

View articletitled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

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Topics: Cooling , Design , Fins , Flow (Dynamics) , Heat flux , Heat sinks , Heat transfer coefficients , Microfluidics , Temperature , Testing

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal

Thomas Brunschwiler, Arvind Sridhar, Chin Lee Ong, Gerd Schlottig

J. Electron. Packag. March 2016, 138(1): 010911. doi: https://doi.org/10.1115/1.4032492

Abstract

View articletitled, Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal

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Topics: Cooling , Fluids , Heat , Thermal management , Silicon , Microchannels

A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney

J. Electron. Packag. March 2016, 138(1): 010912. doi: https://doi.org/10.1115/1.4032494

Abstract

View articletitled, A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership

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Topics: Cooling , Data centers , Hardware , Water

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Sushil Bhavnani, Michael C. Hamilton, R. Wayne Johnson, Roy W. Knight, Daniel K. Harris

J. Electron. Packag. March 2016, 138(1): 010913. doi: https://doi.org/10.1115/1.4032462

Abstract

View articletitled, Durability of Low Melt Alloys as Thermal Interface Materials

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Topics: Alloys , Thermal resistance , Disks , Copper , Wetting , Reliability , Cycles

Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

Jingshi Meng, Abhijit Dasgupta

J. Electron. Packag. March 2016, 138(1): 010914. doi: https://doi.org/10.1115/1.4032495

Abstract

View articletitled, Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

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Topics: Damping , Printed circuit boards , Microbeams

Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application

S. Shanmugan, O. Zeng Yin, P. Anithambigai, D. Mutharasu

J. Electron. Packag. March 2016, 138(1): 011001. doi: https://doi.org/10.1115/1.4032029

Abstract

View articletitled, Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application

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Topics: Boundary-value problems , Thin films , Light-emitting diodes , Temperature , Thermal resistance

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin

J. Electron. Packag. March 2016, 138(1): 011002. doi: https://doi.org/10.1115/1.4032349

Abstract

View articletitled, Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

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Topics: Failure mechanisms , Solder joints , Solders , Surface roughness , Lead-free solders , Intermetallic compounds , Tensile strength , Microcracks , Tin

Analytical Solution for Electronic Assemblies Under Vibration

Mohammad A. Gharaibeh, Quang T. Su, James M. Pitarresi

J. Electron. Packag. March 2016, 138(1): 011003. doi: https://doi.org/10.1115/1.4032497

Abstract

View articletitled, Analytical Solution for Electronic Assemblies Under Vibration

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Topics: Finite element analysis , Mode shapes , Solder joints , Solders , Stiffness , Stress , Vibration , Manufacturing , Deflection , Modal analysis

Editorial

Special Section on InterPACK 2015

Research Papers

Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions

Gas–Liquid Flow Dispersion in Micro-Orifices and Bubble Coalescence With High Flow Rates

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

Modeling Thermal Microspreading Resistance in Via Arrays

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal

A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership

Durability of Low Melt Alloys as Thermal Interface Materials

Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High-Frequency “Breathing Mode” Deformations in the Printed Wiring Board

Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Analytical Solution for Electronic Assemblies Under Vibration

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