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Issues
September 2018
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach
J. Electron. Packag. September 2018, 140(3): 031001.
doi: https://doi.org/10.1115/1.4039790
Topics:
Capacitors
,
Circuits
,
Diffusion (Physics)
,
Modeling
,
Resistors
,
Temperature
,
Wall thickness
Fabrication of Multimeasurand Sensor for Monitoring of a Li-Ion Battery
J. Electron. Packag. September 2018, 140(3): 031002.
doi: https://doi.org/10.1115/1.4039861
Topics:
Sensors
,
Manufacturing
,
Batteries
,
Design
,
Temperature
Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
J. Electron. Packag. September 2018, 140(3): 031003.
doi: https://doi.org/10.1115/1.4039264
Topics:
Coolers
,
Cooling
,
Electronics
,
Flow (Dynamics)
,
Fluids
,
Flux (Metallurgy)
,
Heat
,
Heat flux
,
Manifolds
,
Microchannels
Edge Trimming Induced Defects on Direct Bonded Wafers
Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Eric Beyne
J. Electron. Packag. September 2018, 140(3): 031004.
doi: https://doi.org/10.1115/1.4040002
Topics:
Damage
,
Grinding
,
Semiconductor wafers
,
Stress
,
Bonding
Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
J. Electron. Packag. September 2018, 140(3): 031005.
doi: https://doi.org/10.1115/1.4040105
Topics:
Alloys
,
Fatigue life
,
Solder joints
,
Solders
,
Stress
,
Temperature
,
Cycles
,
Fatigue
Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
J. Electron. Packag. September 2018, 140(3): 031006.
doi: https://doi.org/10.1115/1.4040204
Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies
J. Electron. Packag. September 2018, 140(3): 031007.
doi: https://doi.org/10.1115/1.4040298
Topics:
Flip-chip assemblies
,
Reliability
,
Soldering
,
Tin
,
Solders
,
Finite element analysis
,
Fracture (Materials)
,
Intermetallic compounds
Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures
J. Electron. Packag. September 2018, 140(3): 031008.
doi: https://doi.org/10.1115/1.4040297
Topics:
Stress
,
High cycle fatigue
,
Displacement
,
Silicon
,
Thin films
,
Fatigue life
A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
J. Electron. Packag. September 2018, 140(3): 031009.
doi: https://doi.org/10.1115/1.4040499
Topics:
Overlays (Materials engineering)
,
Packaging
,
Power semiconductor devices
,
Reliability
,
Silicon
,
Wire
,
Gates (Closures)
,
Manufacturing
,
Temperature
,
Heat sinks
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Optimization of Micro-Pillars Electroplating Bonding Processes and Additives
J. Electron. Packag
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
J. Electron. Packag (June 2025)
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
J. Electron. Packag (June 2025)
