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1-20 of 20888
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041118.
Paper No: EP-24-1040
Published Online: August 24, 2024
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011009.
Paper No: EP-23-1055
Published Online: August 24, 2024
Journal Articles
Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011010.
Paper No: EP-24-1039
Published Online: August 24, 2024
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 1 Schematic of IGBT power module More about this image found in Schematic of IGBT power module
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 2 Variations of the normalized number of cycle to failure with the maximum temperature T max . The predictions obtained from failure models based on Δ T * , Δ W in , and Δ ε in are compared with experimental data [ 1 ]. More about this image found in Variations of the normalized number of cycle to failure with the maximum te...
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 3 J ( Δ J )-integral path and T * ( Δ T * ) -integral path More about this image found in J ( Δ J )-integral path and T * ( Δ T * ) -...
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 4 Circular integral paths and domains for J , T * , and Δ T * More about this image found in Circular integral paths and domains for J , T * , and ...
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 5 MLSM for line integral and area integral: ( a ) line integral and ( b ) area integral More about this image found in MLSM for line integral and area integral: ( a ) line integral and ( b ) are...
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 6 Finite element model of Si–Al with a crack More about this image found in Finite element model of Si–Al with a crack
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 7 Temperature dependence of Young's modulus and yield stress of pure Al More about this image found in Temperature dependence of Young's modulus and yield stress of pure Al
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 8 An example of cyclic temperature loading for a PM More about this image found in An example of cyclic temperature loading for a PM
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 9 Time variations of total creep strain and total equivalent plastic strain at a point approximately 10 μ m distant from the crack tip: ( a ) total equivalent creep strain and ( b ) total equivalent plastic strain More about this image found in Time variations of total creep strain and total equivalent plastic strain a...
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 10 Time variations of J -integral values and T * -integral ( Γ ε = 20 μ m ) values calculated for various integral paths in the case of temperature pattern 120–200 °C: ( a ) J -integral and ( b ) T * -integral More about this image found in Time variations of J -integral values and T * -integral ...
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 11 Time variations of T * -integral values for various temperature patterns More about this image found in Time variations of T * -integral values for various temperatu...
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 12 Time variations of Δ T * ( Γ ε = 20 μ m ) around the third temperature cycle for various integral paths in the case of temperature pattern 120–200 °C More about this image found in Time variations of Δ T * ( Γ ε = 20 μ m ...
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 13 Time variations of Δ T * around the third temperature cycle for various temperature patterns More about this image found in Time variations of Δ T * around the third temperature cycle...
Image
in Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 14 Variations of the maximum value of Δ T * , Δ T max * , and approximate Δ T * -value, Δ T app * , caused by the change in the maximum temperature T max of respective temperature patterns More about this image found in Variations of the maximum value of Δ T * , Δ T max...
Image
in Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 1 Illustration of the experimental test setup for high-temperature hygroscopic swelling measurements More about this image found in Illustration of the experimental test setup for high-temperature hygroscopi...
Image
in Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 2 Actual experimental lab setup for high-temperature hygroscopic swelling measurements More about this image found in Actual experimental lab setup for high-temperature hygroscopic swelling mea...
Image
in Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
> Journal of Electronic Packaging
Published Online: August 24, 2024
Fig. 3 Scanning electron microscope images of material specimens' focused ion beam sections: ( a ) EMC-A, ( b ) EMC-B, ( c ) DBF-A, and ( d ) DBF-B More about this image found in Scanning electron microscope images of material specimens' focused ion beam...
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