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Journal Articles

Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

Ziyang Wang, Haibo Zhou, Linjiao Xiao, Lian Duan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031005.
Paper No: EP-23-1069
https://doi.org/10.1115/1.4064704
Published Online: February 28, 2024
View Article titled, Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform
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Topics: Errors, Kinematics, Packaging, Particle swarm optimization, Artificial neural networks, Design, Particulate matter, Trajectories (Physics), Simulation, Displacement
Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
View Article titled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling
Journal Articles

Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm

Jiantao Zhang, Zhengfang Chang, Haida Xu, Dong Qu, Xinyu Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021009.
Paper No: EP-23-1046
https://doi.org/10.1115/1.4064098
Published Online: December 11, 2023
View Article titled, Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm
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Topics: Algorithms, Network models, Printed circuit boards, Artificial neural networks, Flaw detection
Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
https://doi.org/10.1115/1.4052814
Published Online: November 5, 2021
View Article titled, Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging
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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state
Includes: Supplementary data
Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041109.
Paper No: EP-19-1123
https://doi.org/10.1115/1.4047471
Published Online: June 29, 2020
View Article titled, Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits
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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems
Journal Articles

A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages

Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu, Li Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011001.
Paper No: EP-19-1055
https://doi.org/10.1115/1.4047227
Published Online: June 4, 2020
View Article titled, A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages
Open the PDF for A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages in another window
Topics: Artificial neural networks, Fatigue life, Finite element analysis, Modeling, Solder joints, Creep, Finite element model
Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
https://doi.org/10.1115/1.4043482
Published Online: May 17, 2019
View Article titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger
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Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms
Journal Articles

An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids

A. Kargar, B. Ghasemi, S. M. Aminossadati
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011010.
https://doi.org/10.1115/1.4003215
Published Online: March 10, 2011
View Article titled, An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids
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Topics: Artificial neural networks, Computational fluid dynamics, Cooling, Heat, Nanofluids, Electronic components, Temperature
Journal Articles

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Wuwei Feng, Qingfeng Meng, Youbo Xie, Hong Fan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
https://doi.org/10.1115/1.4002900
Published Online: November 19, 2010
View Article titled, On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
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Topics: Bonding, Feature extraction, Signals, Wire bonding, Generators, Principal component analysis, Wire, Damping, Artificial neural networks, Shear strength
Journal Articles

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

Tohru Suwa, Hamid Hadim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
https://doi.org/10.1115/1.2429715
Published Online: April 19, 2006
View Article titled, Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards
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Topics: Genetic algorithms, Heat, Junctions, Optimization, Temperature, Electrical wires, Density, Artificial neural networks, Electronic components
Journal Articles

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

Hamid Hadim, Tohru Suwa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
https://doi.org/10.1115/1.1997161
Published Online: November 16, 2004
View Article titled, A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks
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Topics: Artificial neural networks, Design, Optimization, Ball-Grid-Array packaging, Ball-Grid-Array packages, Solders
Journal Articles

A System for First Order Reliability Estimation of Solder Joints in Area Array Packages

Anand M. Deshpande, Ganesh Subbarayan, Dan Rose
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 6–12.
https://doi.org/10.1115/1.483125
Published Online: December 9, 1999
View Article titled, A System for First Order Reliability Estimation of Solder Joints in Area Array Packages
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Topics: Artificial neural networks, Fatigue life, Reliability, Solder joints, Design, Solders
Journal Articles

Decomposition Techniques for the Efficient Analysis of Area-Array Packages

Anand M. Deshpande, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 13–19.
https://doi.org/10.1115/1.483126
Published Online: August 13, 1999
View Article titled, Decomposition Techniques for the Efficient Analysis of Area-Array Packages
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Topics: Design, Finite element analysis, Solder joints, Solders, Displacement, Artificial neural networks
Journal Articles

Maximizing Solder Joint Reliability Through Optimal Shape Design

A. M. Deshpande, G. Subbarayan, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 149–155.
https://doi.org/10.1115/1.2792227
Published Online: September 1, 1997
View Article titled, Maximizing Solder Joint Reliability Through Optimal Shape Design
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Topics: Reliability, Shape optimization, Solder joints, Optimization, Approximation, Design, Electronic packages, Fatigue life, Artificial neural networks, Ball-Grid-Array packaging
Journal Articles

Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

G. Subbarayan, Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 148–156.
https://doi.org/10.1115/1.2792145
Published Online: September 1, 1996
View Article titled, Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models
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Topics: Artificial neural networks, Engineering simulation, Finite element analysis, Reliability, Simulation, Solder joints, Design, Manufacturing, Finite element model, Ball-Grid-Array packages