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Journal Articles

Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications

Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021008.
Paper No: EP-23-1043
https://doi.org/10.1115/1.4063917
Published Online: December 11, 2023
View Article titled, Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
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Topics: Acoustics, Blades, Experimental design, Flow (Dynamics), Noise (Sound), Pressure, Rotors, Optimization, Geometry
Includes: Supplementary data
Journal Articles

Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation

Patrick A. Walsh, Edmond J. Walsh, Ronan Grimes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021001.
https://doi.org/10.1115/1.4001590
Published Online: May 19, 2010
View Article titled, Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation
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Topics: Blades, Chords (Trusses), Fans, Flow (Dynamics), Pressure, Scaling laws (Mathematical physics), Cooling, Reynolds number, Design
Journal Articles

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Jeffrey Rambo, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 452–459.
https://doi.org/10.1115/1.2056575
Published Online: February 11, 2005
View Article titled, Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet
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Topics: Air flow, Blades, Computational fluid dynamics, Cooling, Energy dissipation, Entropy, Flow (Dynamics), Temperature, Thermal management, Heat
Journal Articles

Thermal Performance of Pin-Fin Fan-Sink Assemblies

R. A. Wirtz, R. Sohal, H. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 26–31.
https://doi.org/10.1115/1.2792197
Published Online: March 1, 1997
View Article titled, Thermal Performance of Pin-Fin Fan-Sink Assemblies
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Topics: Axial flow, Blades, Corners (Structural elements), Diamonds, Fins, Heat sinks, Heat transfer coefficients, Pressure, Shapes, Thermal resistance