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Journal Articles

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041112.
Paper No: EP-24-1042
https://doi.org/10.1115/1.4066044
Published Online: August 9, 2024
View Article titled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
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Topics: Cooling, Elastic moduli, Fluids, Temperature, Thermomechanics, Heat, Energy dissipation, Glass transition, Data centers, Reliability
Journal Articles

Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials

Jiawei Chen, Zhongming Yan, Yang Qiao, Feihong Lin, Yu Wang, Hongcheng Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021011.
Paper No: EP-23-1062
https://doi.org/10.1115/1.4064099
Published Online: December 11, 2023
View Article titled, Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials
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Topics: Energy dissipation, Heat, Topology optimization, Design, Density, Temperature, Topology, Phase change materials
Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031010.
Paper No: EP-22-1063
https://doi.org/10.1115/1.4062530
Published Online: June 23, 2023
View Article titled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
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Topics: Convection, Cooling, Cycles, Heat, Temperature, Heat conduction, Optimization, Thermal resistance, Matlab, Energy dissipation
Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
View Article titled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Minghong Jian, Sinan Su, Sa'd Hamasha, Mohammad M. Hamasha, Atif Alkhazali
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011008.
Paper No: EP-19-1117
https://doi.org/10.1115/1.4047341
Published Online: June 23, 2020
View Article titled, Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint
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Topics: Alloys, Fatigue, Fatigue life, Solder joints, Solders, Stress, Cycles, Energy dissipation, Fatigue properties, Reliability
Journal Articles

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Jie Liu, Jinglong Zou, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011003.
Paper No: EP-19-1078
https://doi.org/10.1115/1.4046762
Published Online: June 4, 2020
View Article titled, Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp
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Topics: Energy dissipation, Heat, Light-emitting diodes, Optimization, Phosphors, Temperature, Junctions, Natural convection, Thermal analysis, Fins
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Article titled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry
Journal Articles

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Weijun Zhu, Gang Dong, Yintang Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
https://doi.org/10.1115/1.4040670
Published Online: August 3, 2018
View Article titled, Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network
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Topics: Density, Design, Heat, Modeling, Optimization, Silicon, Temperature, Simulation, Energy dissipation, Gates (Closures)
Journal Articles

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G. K. E. Sng, J. W. Ronnie Teo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031003.
Paper No: EP-16-1108
https://doi.org/10.1115/1.4036066
Published Online: June 14, 2017
View Article titled, Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes
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Topics: Bonding, Energy dissipation, Heat, Light-emitting diodes, Operating temperature, Packaging, Phosphors, Temperature, Thermal resistance, Light emission
Journal Articles

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010902.
Paper No: EP-15-1090
https://doi.org/10.1115/1.4032346
Published Online: March 10, 2016
View Article titled, Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages
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Topics: Energy dissipation, Experimental characterization, Heat transfer, Heating, Thermal conductivity, Thermal resistance, Thermal analysis, Cooling, Temperature, Temperature profiles
Journal Articles

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Zhi Huang, Xinsheng Zhang, Ming Zhou, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2012, 134(1): 014501.
https://doi.org/10.1115/1.4005908
Published Online: March 19, 2012
View Article titled, Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices
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Topics: Biomimetics, Cooling, Energy dissipation, Heat, Microelectronic devices, Skin, Temperature, Natural convection
Journal Articles

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Zhanyu Sun, Yogesh Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
https://doi.org/10.1115/1.4004218
Published Online: June 23, 2011
View Article titled, Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel
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Topics: Bronze, Gas flow, Heat flux, Heat transfer, Microchannels, Nitrogen, Slip flow, Temperature, Thermal conductivity, Silicon nitride ceramics
Journal Articles

Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs

Yueguang Deng, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031009.
https://doi.org/10.1115/1.4002012
Published Online: September 9, 2010
View Article titled, Design of Practical Liquid Metal Cooling Device for Heat Dissipation of High Performance CPUs
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Topics: Cooling, Design, Energy dissipation, Heat, Liquid metals, Pumps, Thermal resistance, Water, Flow (Dynamics), Engineering prototypes
Journal Articles

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

Varghese Panthalookaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031007.
https://doi.org/10.1115/1.4002009
Published Online: September 9, 2010
View Article titled, CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device
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Topics: Computational fluid dynamics, Cooling, Energy dissipation, Flow (Dynamics), Heat, Temperature, Natural convection, MOSFET transistors, Separation (Technology), Optimization
Journal Articles

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Chuen-Ching Wang, Yao-Ting Ye, Jing-Fung Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
https://doi.org/10.1115/1.4000363
Published Online: November 12, 2009
View Article titled, Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
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Topics: Adhesives, Complementary metal oxide semiconductors, Energy dissipation, Glass, Packaging, Sensors, Taguchi methods, Temperature, Bonding, Heat
Journal Articles

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

D. Bhate, G. Subbarayan, J. Zhao, V. Gupta, D. Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044502.
https://doi.org/10.1115/1.4000208
Published Online: November 12, 2009
View Article titled, Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
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Topics: Geometry, Solder joints, Solders, Failure, Fatigue, Alloys, Energy dissipation
Journal Articles

Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces

Karl J. L. Geisler, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041002.
https://doi.org/10.1115/1.2993135
Published Online: November 14, 2008
View Article titled, Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces
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Topics: Aluminum, Boiling, Heat sinks, Heat, Fins, Thermal conductivity, Critical heat flux, Silicon, Energy dissipation, Heat transfer coefficients
Journal Articles

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Tong Hong Wang, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2007, 129(3): 366–370.
https://doi.org/10.1115/1.2753988
Published Online: September 12, 2006
View Article titled, Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
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Topics: Convection, Density, Energy dissipation, Flat heat pipes, Heat transfer, Temperature