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Journal Articles

Hybrid Substrates for Heterogeneous Integration

John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu, Y. H. Chen, Tzyy-Jang Tseng, Ming Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021001.
Paper No: EP-23-1025
https://doi.org/10.1115/1.4062993
Published Online: August 11, 2023
View Article titled, Hybrid Substrates for Heterogeneous Integration
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Topics: Bonding, Metals, Solder joints, Reliability, Dielectric materials
Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031006.
Paper No: EP-22-1008
https://doi.org/10.1115/1.4056640
Published Online: February 1, 2023
View Article titled, Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
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Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation
Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021119.
Paper No: EP-21-1057
https://doi.org/10.1115/1.4054131
Published Online: April 22, 2022
View Article titled, Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology
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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature
Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
View Article titled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data
Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
https://doi.org/10.1115/1.4053365
Published Online: January 28, 2022
View Article titled, Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Article titled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041108.
Paper No: EP-21-1037
https://doi.org/10.1115/1.4052711
Published Online: November 2, 2021
View Article titled, Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Open the PDF for Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies in another window
Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

Chang-Chun Lee, Kuo-Shu Kao, Chi-Wei Wang, Tai-Jyun Yu, Tai-Kuang Lee, Po-Kai Chiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
https://doi.org/10.1115/1.4052072
Published Online: September 13, 2021
View Article titled, Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate
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Topics: Manufacturing, Metals, Molding materials, Reliability, Silicones, Solders, Epoxy resins, Finite element analysis, Mechanical behavior
Journal Articles

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2020, 142(4): 040801.
Paper No: EP-19-1126
https://doi.org/10.1115/1.4047472
Published Online: June 29, 2020
View Article titled, Comparative Study on Power Module Architectures for Modularity and Scalability
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Topics: Architecture, Cooling, Design, Electric vehicles, Electronics, Patents, Hybrid electric vehicles, Traction, Coolants, Metals
Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
https://doi.org/10.1115/1.4047409
Published Online: June 26, 2020
View Article titled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
Open the PDF for Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules in another window
Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)
Journal Articles

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
https://doi.org/10.1115/1.4047063
Published Online: May 13, 2020
View Article titled, Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cycles, Melting, Metals, Solidification, Temperature, Alloys, Stability
Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031107.
Paper No: EP-19-1129
https://doi.org/10.1115/1.4046849
Published Online: April 24, 2020
View Article titled, Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink
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Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density
Journal Articles

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Xiaohui Song, Rui Zhang, Huadong Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021005.
Paper No: EP-19-1105
https://doi.org/10.1115/1.4046164
Published Online: February 19, 2020
View Article titled, Atomic Study on Copper–Copper Bonding Using Nanoparticles
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Topics: Atoms, Bonding, Copper, Metals, Nanoparticles, Pressure, Temperature, Deformation, External pressure
Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011003.
Paper No: EP-19-1014
https://doi.org/10.1115/1.4044476
Published Online: September 19, 2019
View Article titled, Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems
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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Electroplated Connections Between Carbon Fiber and Nickel

Christopher Bilger, Hugh A. Bruck, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011009.
Paper No: EP-16-1045
https://doi.org/10.1115/1.4035703
Published Online: January 27, 2017
View Article titled, Electroplated Connections Between Carbon Fiber and Nickel
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Topics: Carbon fibers, Nickel, Metals, Carbon, Solders, Batteries, Electroplating
Journal Articles

Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials

Yunxia Gao, Xianping Wang, Jing Liu, Qianfeng Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011002.
Paper No: EP-16-1099
https://doi.org/10.1115/1.4035025
Published Online: November 23, 2016
View Article titled, Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials
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Topics: Alloys, Copper, Gallium, Gallium alloys, Temperature, Thermal conductivity, Oxidation, Thermal resistance, Aluminum alloys, Metals
Journal Articles

Nanothermal Interface Materials: Technology Review and Recent Results

Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2015, 137(4): 040803.
Paper No: EP-15-1063
https://doi.org/10.1115/1.4031602
Published Online: October 9, 2015
View Article titled, Nanothermal Interface Materials: Technology Review and Recent Results
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Topics: Copper, Cycles, Electrical resistivity, Solders, Teams, Temperature, Testing, Thermal resistance, Bonding, Accelerated life testing
Journal Articles

Electromigration Simulation for Metal Lines

JianPing Jing, Lihua Liang, Guang Meng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011002.
https://doi.org/10.1115/1.4000716
Published Online: March 4, 2010
View Article titled, Electromigration Simulation for Metal Lines
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Topics: Algorithms, Atoms, Density, Electrodiffusion, Simulation, Stress, Current density, Failure, Metals, Temperature