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Journal Articles

Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm

Jiantao Zhang, Zhengfang Chang, Haida Xu, Dong Qu, Xinyu Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021009.
Paper No: EP-23-1046
https://doi.org/10.1115/1.4064098
Published Online: December 11, 2023
View Article titled, Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm
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Topics: Algorithms, Network models, Printed circuit boards, Artificial neural networks, Flaw detection
Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
View Article titled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems
Journal Articles

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L, Huanyu Liao, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041005.
Paper No: EP-20-1011
https://doi.org/10.1115/1.4048729
Published Online: October 28, 2020
View Article titled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
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Topics: Algorithms, Particulate matter, Optimization, Network models
Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
https://doi.org/10.1115/1.4039136
Published Online: May 9, 2018
View Article titled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
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Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties
Journal Articles

Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes

Stephen H. Taylor, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
https://doi.org/10.1115/1.4028075
Published Online: September 19, 2014
View Article titled, Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes
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Topics: Capacitance, Electrodes, Junctions, Network models, Sensors
Journal Articles

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

A. Gholami, M. Ahmadi, M. Bahrami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031010.
Paper No: EP-14-1011
https://doi.org/10.1115/1.4027509
Published Online: May 12, 2014
View Article titled, A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems
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Topics: Cooling systems, Flat heat pipes, Heat, Heat pipes, Heat sinks, Network models, Temperature, Thermal resistance, Dynamic testing (Materials), Transients (Dynamics)
Journal Articles

An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

B. Dan, B. G. Sammakia, G. Subbarayan, S. Kanuparthi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031003.
Paper No: EP-12-1098
https://doi.org/10.1115/1.4024392
Published Online: June 4, 2013
View Article titled, An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
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Topics: Particulate matter, Thermal conductivity, Electrical conductance, Network models, Approximation
Journal Articles

Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus

Jong-Jin Park, Minoru Taya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 46–52.
https://doi.org/10.1115/1.2159008
Published Online: September 23, 2005
View Article titled, Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus
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Topics: Network models, Resistors, Thermal conductivity, Thermometers, Temperature, Carbon nanotubes, Thermal resistance, Design
Journal Articles

A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

Sarang Shidore, Tien Yu Tom Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 232–237.
https://doi.org/10.1115/1.1349423
Published Online: November 27, 2000
View Article titled, A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package
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Topics: Computational fluid dynamics, Forced convection, Junctions, Natural convection, Network models, Resistors, Temperature, Optimization, Ball-Grid-Array packaging, Modeling
Journal Articles

Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

A. Hadim, N. J. Nagurny
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 300–304.
https://doi.org/10.1115/1.2905454
Published Online: September 1, 1992
View Article titled, Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules
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Topics: Design, Cavities, Computer software, Heat conduction, Heat transfer, Network models, Solders, Thermal analysis