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Journal Articles

The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

Justin H. Chow, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041104.
Paper No: EP-23-1035
https://doi.org/10.1115/1.4063485
Published Online: October 9, 2023
View Article titled, The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
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Topics: Inks, Particulate matter, Percolation theory, Resistors, Silver, Modeling
Journal Articles

Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life

Jonghwan Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
https://doi.org/10.1115/1.4063058
Published Online: August 17, 2023
View Article titled, Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
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Topics: Fatigue life, Resistors, Shapes, Solder joints, Solders, Thermal shock, Manufacturing
Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021106.
Paper No: EP-21-1010
https://doi.org/10.1115/1.4052070
Published Online: October 6, 2021
View Article titled, Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Article titled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach

Ž. Staliulionis, H. Conseil-Gudla, S. Mohanty, M. Jabbari, R. Ambat, J. H. Hattel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
https://doi.org/10.1115/1.4039790
Published Online: May 10, 2018
View Article titled, Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach
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Topics: Capacitors, Circuits, Diffusion (Physics), Modeling, Resistors, Temperature, Wall thickness
Journal Articles

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

Outmane Lemtiri Chlieh, Wasif T. Khan, John Papapolymerou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031009.
Paper No: EP-14-1104
https://doi.org/10.1115/1.4030643
Published Online: September 1, 2015
View Article titled, Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate
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Topics: Cooling, Flow (Dynamics), Heat, Manufacturing, Microchannels, Microfluidics, Resistors, Temperature, Thermal resistance, Water
Journal Articles

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011009.
https://doi.org/10.1115/1.4006137
Published Online: March 21, 2012
View Article titled, Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method
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Topics: Heat, Heating, Joules, Temperature, Transients (Dynamics), Transmission lines, Steady state, Resistors, Currents, Simulation
Journal Articles

Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate

Dapeng Zhu, Xiaoqin Lin, Le Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011006.
https://doi.org/10.1115/1.3068305
Published Online: February 12, 2009
View Article titled, Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate
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Topics: Resistors, Thin films, Tantalum
Journal Articles

Compact Thermal Models: A Global Approach

Mohamed-Nabil Sabry, Hossam Saleh Abdelmeguid
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041107.
https://doi.org/10.1115/1.2993132
Published Online: November 14, 2008
View Article titled, Compact Thermal Models: A Global Approach
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Topics: Boundary-value problems, Cooling, Heat, Reliability, Temperature, Thermal analysis, Heat flux, Modeling, Resistors, Heat transfer
Journal Articles

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, John Evans, Jeff Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
https://doi.org/10.1115/1.2804086
Published Online: March 7, 2007
View Article titled, Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments
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Topics: Ball-Grid-Array packaging, Crack propagation, Cycles, Fracture (Materials), Lumber, Metals, Reliability, Resistors, Solder joints, Printed circuit boards
Journal Articles

Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus

Jong-Jin Park, Minoru Taya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 46–52.
https://doi.org/10.1115/1.2159008
Published Online: September 23, 2005
View Article titled, Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus
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Topics: Network models, Resistors, Thermal conductivity, Thermometers, Temperature, Carbon nanotubes, Thermal resistance, Design
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
https://doi.org/10.1115/1.1534842
Published Online: March 14, 2003
View Article titled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
https://doi.org/10.1115/1.1502666
Published Online: December 12, 2002
View Article titled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Reliability, Shear (Mechanics), Shear strength, Solders, Silver, Resistors
Journal Articles

A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

Zs. Benedek, B. Courtois, G. Farkas, E. Kolla´r, S. Mir, A. Poppe, M. Rencz, V. Sze´kely, K. Torki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 323–330.
https://doi.org/10.1115/1.1389846
Published Online: June 2, 2001
View Article titled, A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation
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Topics: Design, Sensors, Temperature, Energy dissipation, Transients (Dynamics), Packaging, Resistors, Composite materials, Complementary metal oxide semiconductors
Journal Articles

A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

Sarang Shidore, Tien Yu Tom Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 232–237.
https://doi.org/10.1115/1.1349423
Published Online: November 27, 2000
View Article titled, A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package
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Topics: Computational fluid dynamics, Forced convection, Junctions, Natural convection, Network models, Resistors, Temperature, Optimization, Ball-Grid-Array packaging, Modeling
Journal Articles

Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints

Edward Jih, Yi-Hsin Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 94–99.
https://doi.org/10.1115/1.2792087
Published Online: June 1, 1995
View Article titled, Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints
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Topics: Design, Resistors, Solder joints, Finite element analysis, Capacitors, Cracking (Materials), Creep, Electronic packaging, Failure, Fatigue
Journal Articles

A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints

N. Paydar, Y. Tong, H. U. Akay
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 265–273.
https://doi.org/10.1115/1.2905697
Published Online: December 1, 1994
View Article titled, A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints
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Topics: Fatigue life, Finite element analysis, Solder joints, Cycles, Alloys, Constitutive equations, Creep, Design, Grain size, Manufacturing
Journal Articles

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

R. K. Govila, E. Jih, Y.-H. Pao, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 83–88.
https://doi.org/10.1115/1.2905509
Published Online: June 1, 1994
View Article titled, Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
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Topics: Fatigue damage, Resistors, Solder joints, Solders, Damage, Stress concentration, Corners (Structural elements), Cracking (Materials), Cycles, Design
Journal Articles

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, R. W. Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 203–215.
https://doi.org/10.1115/1.2905397
Published Online: September 1, 1991
View Article titled, Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages
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Topics: Electronic packages, Sensors, Stress, Structural analysis, Semiconductor wafers, Crystals, Design, Diamonds, Heat conduction, Integrated circuits
Journal Articles

A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling

Boon Wong, D. E. Helling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 104–109.
https://doi.org/10.1115/1.2904349
Published Online: June 1, 1990
View Article titled, A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling
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Topics: Failure, Solder joints, Fracture (Materials), Solders, Crack propagation, Surface mount packaging, Deformation, Resistors, Tin