1-10 of 10
Thermal shock
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life

Jonghwan Ha, Yangyang Lai, Junbo Yang, Pengcheng Yin, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
https://doi.org/10.1115/1.4063058
Published Online: August 17, 2023
View Article titled, Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
Open the PDF for Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life in another window
Topics: Fatigue life, Resistors, Shapes, Solder joints, Solders, Thermal shock, Manufacturing
Journal Articles

Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package

Ke Zhong, Huanpeng Wang, Jingrou Wang, Yuehang Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011002.
Paper No: EP-22-1090
https://doi.org/10.1115/1.4062344
Published Online: May 2, 2023
View Article titled, Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
Open the PDF for Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package in another window
Topics: Ball-Grid-Array packaging, Fatigue life, Heat, Heating, Reliability, Solders, Stress, Temperature, Thermal shock, Cycles
Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
https://doi.org/10.1115/1.4040978
Published Online: September 10, 2018
View Article titled, Reactive Joining of Thermally and Mechanically Sensitive Materials
Open the PDF for Reactive Joining of Thermally and Mechanically Sensitive Materials in another window
Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock
Journal Articles

Interactions Between Flip Chip Underfill and Solder Alloy

D. Blass, P. Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031008.
https://doi.org/10.1115/1.4002010
Published Online: September 9, 2010
View Article titled, Interactions Between Flip Chip Underfill and Solder Alloy
Open the PDF for Interactions Between Flip Chip Underfill and Solder Alloy in another window
Topics: Alloys, Flip-chip, Flip-chip devices, Solders, Thermal shock, Thermal expansion, Testing, Adhesion, Reliability, Cycles
Journal Articles

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Saketh Mahalingam, Ananth Prabhakumar, Sandeep Tonapi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041005.
https://doi.org/10.1115/1.3010378
Published Online: November 17, 2008
View Article titled, Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials
Open the PDF for Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials in another window
Topics: Delamination, Flip-chip assemblies, Flow (Dynamics), Thermal shock, Fracture (Materials), Thermomechanics, Fatigue
Journal Articles

Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 142–147.
https://doi.org/10.1115/1.1649245
Published Online: April 30, 2004
View Article titled, Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method
Open the PDF for Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method in another window
Topics: Fracture (Materials), Laser beams, Lasers, Microcracks, Semiconductor wafers, Thermal shock, Thermal stresses, Temperature
Journal Articles

The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies

Y. P. Wu, P. L. Tu, Yan C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 284–289.
https://doi.org/10.1115/1.1371782
Published Online: July 7, 1999
View Article titled, The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies
Open the PDF for The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies in another window
Topics: Fatigue life, Reliability, Solder joints, Solders, Thermal shock, Ball-Grid-Array packaging, Vibration, Ceramics, Nitrogen, Cycles
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
View Article titled, Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM
Open the PDF for Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM in another window
Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis
Journal Articles

Advances in Bonding Technology for Electronic Packaging

Chin C. Lee, Chen Y. Wang, Goran Matijasevic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 201–207.
https://doi.org/10.1115/1.2909318
Published Online: June 1, 1993
View Article titled, Advances in Bonding Technology for Electronic Packaging
Open the PDF for Advances in Bonding Technology for Electronic Packaging in another window
Topics: Bonding, Electronic packaging, Alloys, Temperature, Acoustics, Diffusion (Physics), Melting point, Microscopy, Oxidation, Soldering
Journal Articles

Solder Fillet Height Criteria for Surface Mounted Chip Components

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 299–302.
https://doi.org/10.1115/1.3226551
Published Online: December 1, 1989
View Article titled, Solder Fillet Height Criteria for Surface Mounted Chip Components
Open the PDF for Solder Fillet Height Criteria for Surface Mounted Chip Components in another window
Topics: Solders, Capacitors, Ceramics, Solder joints, Thermal shock, Cycles, Fracture (Materials), Lumber, Navy, Tantalum