... to the Anand viscoplasticity model, and Anand constants were calculated by estimating high strain rate behavior throughout a wide range of operating temperatures and stress levels. In addition, for BGA package assembly with PCB, FE analysis was performed for drop/shock events. For varied aging circumstances...

.... The materials characterization of SAC (SAC105 and SAC-Q) solder after extended storage at low working temperatures (−65 °C–0 °C) and high strain rates (10–75 per sec) is investigated in this article. To characterize the material constitutive behavior, the Anand viscoplastic model was utilized to derive nine...

... (10–75 per sec) has been studied. Stress–strain curves have been measured at low operating temperatures using impact hammer-based tensile tests with cooling chamber. The fabricated SAC lead-free solder specimen was isothermally aged up to 6 months at 50 °C before testing. Anand viscoplastic model has...

... curves are developed and described in this paper for a wide range of strain rates and test temperatures. Furthermore, the test results and data measured have been matched to the Anand viscoplasticity model and Anand constants have been determined by estimation of the high strain rate behavior measured...

... temperatures of (25 °C–200 °C). The SAC lead-free solder samples were subjected to isothermal aging at 50 °C up to 1-year before testing. To describe the material constitutive behavior, the Anand Viscoplastic model has been used. The effect of thermal aging on Anand parameters also has been investigated...

... have been fitted to the Anand viscoplasticity model for SAC-Q for comparison. e-mail:  lall@auburn.edu This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government's contributions. 02 01 2020 25 05 2020 23 06 2020 SAC-Q high...