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Keywords: LGA
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Journal Articles
Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010906.
Paper No: EP-15-1094
Published Online: March 10, 2016
..., and mechanical coupling on warpage, strains, and stresses, we simulate finite element models of five different topologies on an organic land-grid array (LGA) carrier. We measure the thermal performance in terms of thermal resistance from cold-plate base to inlet liquid and obtain 15 mm 2 K/W at 30 kPa pressure...