.... Syst. , 8 ( 2 ), pp. 711 – 720 10.4271/2015-01-1709 . Power packaging Thermal analysis Worldwide efforts in minimizing CO 2 emissions, resulting from growing concerns about the effects of greenhouse gases on climate, have been a major driver in increasing electrification...

... Frequency, Low Cost, Power Packaging Using Thin Film Power Overlay Technology ,” Tenth Annual IEEE Applied Power Electronics Conference and Exposition ( APEC ), Dallas, TX, Mar. 5–9, pp. 12–17. 10.1109/APEC.1995.468955 [12] Gowda , A. , Tuominen , R. , and McConnelee , P. , 2014...

... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...

... would also like to acknowledge InterPACK 2017 General Conference Chair Dr. Mehdi Asheghi and JEP Editor Professor Y. C. Lee for their support and cooperation. 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors...

... environment Power packaging Solder Power electronic devices are subject to continuously increasing heat dissipation levels because of growing current densities and voltage levels. Simultaneously, power electronic systems are becoming more miniaturized, further increasing dissipation heat flux...

... of failure Power packaging Solder Thermal analysis High-temperature electronics and next generation power electronics operate at temperatures above 200 °C. Conventional Sn based compositions have very high homologous temperatures at these operating conditions which result in rapid microstructural...

... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received November 12, 2016; final manuscript received September 28, 2017; published online October 25, 2017. Assoc. Editor: Shi-Wei Ricky Lee. 12 11 2016 28 09 2017 Conductive adhesives Power packaging Reliability...

... ACKAGING . Manuscript received March 9, 2017; final manuscript received September 21, 2017; published online October 25, 2017. Assoc. Editor: Kaushik Mysore. 09 03 2017 21 09 2017 3D packaging CSP Flip chip High density interconnects Power packaging Wirebond In general...

... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 30, 2016; final manuscript received November 13, 2016; published online December 7, 2016. Assoc. Editor: Xiaobing Luo. 30 08 2016 13 11 2016 Flexible circuits FR-4 Polyimide Power...

...K. S. Siow; Y. T. Lin The corresponding author is K. S. Siow. Nanotechnolgy Power packaging Solder 25 04 2016 13 05 2016 Copyright © 2016 by ASME 2016 1043-7398/2016/138(3)/037001/1/ $25.00 ...

... was developed in-house by Siemens Microelectronics in 1987 to bond large area power thyristors on molybdenum substrates [ 6 ]. Their initial formulation of sintered Ag pastes consisted only of micron-sized Ag flakes and cyclohexanol [ 6 ]. Conductive adhesives Nanotechnolgy Power packaging Solder...

... received February 15, 2016; published online March 23, 2016. Assoc. Editor: Yi-Shao Lai. 07 10 2015 15 02 2016 Failure analysis Power packaging Reliability Interconnection materials in electric devices undergo cyclic stress caused by a mismatch of thermal expansion...

.... Assoc. Editor: Xiaobing Luo. 25 09 2015 08 12 2015 Power packaging Thermal analysis The combined trend of increasing computing performance and miniaturization in electronics has brought up a new challenge: increased heat losses have to be dissipated in smaller volumes, thus...

... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 25, 2015; final manuscript received January 8, 2016; published online March 10, 2016. Assoc. Editor: Toru Ikeda. 25 09 2015 08 01 2016 3D packaging LGA Power packaging Reliability Thermal analysis...

... performance ever achieved on multilayer organic substrates. Flexible circuits Organic electronics Power packaging SOP Thermal analysis System packaging plays a key role in modern electronic devices. Packaging technologies have evolved with time to solve the growing challenges of electronic...

... at the current heat removal rate. With the 25% increased heat transfer option, high heat fluxes up to 250 W/cm 2 (typical for wideband-gap semiconductor applications) are possible by using the subcooled boiling system. Power packaging Thermal analysis The current cooling technology for the power...

... of 67.7 were measured at an average jet Reynolds number of 14,000. Power packaging Thermal analysis Power electronics such as metal–oxide–semiconductor field-effect transistors (MOSFETs), gate turn-off thyristors (GTOs), insulated-gate bipolar transistors (IGBTs), and integrated gate...