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Keywords: drop/shock FE analysis
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
Published Online: March 11, 2024
... drop/shock FE analysis Extreme temperatures paired with high strain rates have been recorded in a variety of applications, including aeronautics, aircraft, medical technology, and oil and gas explorations. Electronic packaging board assemblies may be subjected to shocks, collisions, and shock...
