... to the Anand viscoplasticity model, and Anand constants were calculated by estimating high strain rate behavior throughout a wide range of operating temperatures and stress levels. In addition, for BGA package assembly with PCB, FE analysis was performed for drop/shock events. For varied aging circumstances...

... been made using Sn–Ag–Cu and the addition of Bi (SAC+Bi). It was discovered that adding dopants to SAC alloys may enhance mechanical characteristics and reduce aging damage. There is no published data on SAC solder alloys after prolonged storage at high strain rates and low functioning temperatures...

...) to SAC alloy can play an important role to make the solder alloy resistant to aging-induced degradations. In author's prior research the evolution of Anand parameters and materials properties for SAC solder (SAC105, SAC305, and SAC-Q) at high temperatures and high strain rates has been studied. However...

... curves are developed and described in this paper for a wide range of strain rates and test temperatures. Furthermore, the test results and data measured have been matched to the Anand viscoplasticity model and Anand constants have been determined by estimation of the high strain rate behavior measured...

...Pradeep Lall; Vikas Yadav; Jeff Suhling; David Locker Electronic components in downhole oil drilling and gas industry applications, automotive, and avionics may be exposed to high temperatures (>150 °C) and high strain rates (1–100 per sec) during storage, operation, and handling, which can...

...Pradeep Lall; Vishal Mehta; Jeff Suhling; David Locker Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and shock...

... fillet failures. The second-level interconnects may be experience high strain rates and accrue damage during repetitive exposure to mechanical shock. Industry migration to lead-free solders has resulted in proliferation of a wide variety of solder alloy compositions. One of the popular tin-silver-copper...