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Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
... for the interface reliability of coaxial TSV under complex structural conditions since it has higher accuracy and stronger robustness. 1 Corresponding author. e-mail:  lyzhangliwen@163.com e-mail:  yangchen202106@163.com e-mail:  yanghejn2021@163.com e-mail:  15903790309@139.com e...
View Article titled, <span class="search-highlight">Interface</span> <span class="search-highlight">Reliability</span> Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling