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Keywords: low-temperature testing
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
Published Online: March 11, 2024
... of SAC-Q solder ball joints, hysteresis stress–strain curves and plastic work density curves are generated. e-mail: lall@auburn.edu 31 03 2022 01 01 2024 11 03 2024 low-temperature testing high-temperature aging high strain rate SAC-Q Anand viscoplastic model...