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Keywords: modular manifold design
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Journal Articles
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant V. J. Narumanchi, Yogendra Joshi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021007.
Paper No: EP-23-1026
Published Online: December 6, 2023
... 06 2023 06 12 2023 modular manifold design DBC-embedded heat sink jet impingement SiC power module Automotive power electronics packaging is moving toward system integration and increasing power density. These trends can increase the density of system functionality and enhance...