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Keywords: organic interposer
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Journal Articles
John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu, Y. H. Chen, Tzyy-Jang Tseng, Ming Li
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021001.
Paper No: EP-23-1025
Published Online: August 11, 2023
...John H. Lau; Gary Chang-Fu Chen; Channing Cheng-Lin Yang; Vincent Teng; Andy Yan-Jia Peng; Jones Yu-Cheng Huang; Hsing-Ning Liu; Y. H. Chen; Tzyy-Jang Tseng; Ming Li The hybrid substrate (organic interposer + build-up package substrate + solder joints + underfill) of multiple systems...