... circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits optoelectronics embedded 3D hybrid integration system in package thermal design The major trend...

...., CSPs and Flip Chips. To further integrate more functionality into devices, and to further increase the degree of miniaturization, packaging development focus is switching from single chip packaging to the realization of systems in package, SiPs. Two main approaches do exist to realize this goal: one...