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Keywords: three-dimensional integrated circuits
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Journal Articles

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

Vikram Venkatadri, Bahgat Sammakia, Krishnaswami Srihari, Daryl Santos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041011.
https://doi.org/10.1115/1.4005298
Published Online: December 9, 2011
... 41 Akturk , A. , Goldsman , N. , and Metze , G. , 2005 , “ Coupled Simulation of Device Performance and Heating of Vertically Stacked Three Dimensional Integrated Circuits ,” International Conference on Simulation of Semiconductor Processes and Devices , pp. 115 – 18 . 42...
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Topics: Thermal management, Cooling, Silicon, Circuits, Integrated circuits, Heat
Journal Articles

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
https://doi.org/10.1115/1.4004861
Published Online: September 26, 2011
... circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits optoelectronics embedded 3D hybrid integration system in package thermal design The major trend...
View Articletitled, Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
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Topics: Design, Polymers, System-in-package, Waveguides, Simulation, Printed circuit boards, Optical interconnections, Integrated circuits, Engineering simulation, Heat
Journal Articles

Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models

Jamil A. Wakil, Patrick W. Dehaven, Nancy R. Klymko, Shaochen Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031001.
https://doi.org/10.1115/1.4004656
Published Online: September 14, 2011
...- induced stresses dominate. 31 03 2010 06 06 2011 14 09 2011 14 09 2011 finite element analysis integrated circuit packaging integrated circuit reliability Raman spectroscopy three-dimensional integrated circuits 3D packaging has spurred significant research...
View Articletitled, Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models
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Topics: Finite element model, Reliability, Silicon, Stress, Temperature, Thermomechanics, Transients (Dynamics), Warping, Laminates, Deformation