Aerosol jet printing (AJP) is a direct write technology that enables fabrication of flexible, fine scale printed electronics on conformal substrates. AJP does not require the time consuming mask and postpatterning processes compared with traditional electronics manufacturing techniques. Thus, the cycle time can be dramatically reduced, and highly personalized designs of electronics can be realized. AJP has been successfully applied to a variety of industries, with different combinations of inks and substrates. However, the quality of the printed electronics, such as resistance, is not able to be measured online. On the other hand, the microscopic image sensors are widely used for printed circuit boards (PCBs) quality quantification and inspection. In this paper, two widely used quality variables of printed electronics, resistance and overspray, will be jointly modeled based on microscopic images for fast quality assessment. Augmented quantitative and qualitative (AUGQQ) models are proposed to use features of microscopic images taken at different locations on the printed electronics as input variables, and resistance and overspray as output variables. The association of resistance and overspray can be investigated through the AUGQQ models formulation. A case study for fabricating silver lines with Optomec® aerosol jet system is used to evaluate the model performance. The proposed AUGQQ models can help assess the printed electronics quality and identify important image features in a timely manner.
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July 2017
Research-Article
Quality Modeling of Printed Electronics in Aerosol Jet Printing Based on Microscopic Images
Hongyue Sun,
Hongyue Sun
Mem. ASME
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: hongyue@vt.edu
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: hongyue@vt.edu
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Kan Wang,
Kan Wang
Mem. ASME
H. Milton Stewart School of Industrial
and Systems Engineering,
Georgia Tech,
Atlanta, GA 30332
e-mail: kwang34@mail.gatech.edu
H. Milton Stewart School of Industrial
and Systems Engineering,
Georgia Tech,
Atlanta, GA 30332
e-mail: kwang34@mail.gatech.edu
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Yifu Li,
Yifu Li
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: liyifu@vt.edu
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: liyifu@vt.edu
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Chuck Zhang,
Chuck Zhang
H. Milton Stewart School of Industrial
and Systems Engineering,
Georgia Tech,
Atlanta, GA 30332
e-mail: chuck.zhang@gatech.edu
and Systems Engineering,
Georgia Tech,
Atlanta, GA 30332
e-mail: chuck.zhang@gatech.edu
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Ran Jin
Ran Jin
Mem. ASME
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: jran5@vt.edu
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: jran5@vt.edu
Search for other works by this author on:
Hongyue Sun
Mem. ASME
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: hongyue@vt.edu
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: hongyue@vt.edu
Kan Wang
Mem. ASME
H. Milton Stewart School of Industrial
and Systems Engineering,
Georgia Tech,
Atlanta, GA 30332
e-mail: kwang34@mail.gatech.edu
H. Milton Stewart School of Industrial
and Systems Engineering,
Georgia Tech,
Atlanta, GA 30332
e-mail: kwang34@mail.gatech.edu
Yifu Li
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: liyifu@vt.edu
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: liyifu@vt.edu
Chuck Zhang
H. Milton Stewart School of Industrial
and Systems Engineering,
Georgia Tech,
Atlanta, GA 30332
e-mail: chuck.zhang@gatech.edu
and Systems Engineering,
Georgia Tech,
Atlanta, GA 30332
e-mail: chuck.zhang@gatech.edu
Ran Jin
Mem. ASME
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: jran5@vt.edu
Grado Department of Industrial
and Systems Engineering,
Virginia Tech,
Blacksburg, VA 24061
e-mail: jran5@vt.edu
1Corresponding author.
Manuscript received March 30, 2016; final manuscript received December 19, 2016; published online April 10, 2017. Assoc. Editor: Sam Anand.
J. Manuf. Sci. Eng. Jul 2017, 139(7): 071012 (10 pages)
Published Online: April 10, 2017
Article history
Received:
March 30, 2016
Revised:
December 19, 2016
Citation
Sun, H., Wang, K., Li, Y., Zhang, C., and Jin, R. (April 10, 2017). "Quality Modeling of Printed Electronics in Aerosol Jet Printing Based on Microscopic Images." ASME. J. Manuf. Sci. Eng. July 2017; 139(7): 071012. https://doi.org/10.1115/1.4035586
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