Reactively bonded solder joints with Al/Ni exothermic films attract much attention in semiconductor and microelectromechanical systems (MEMS) industries. Higher bond strength of the joints is required for long-term mechanical reliability. We have investigated the strength of rectangular-solid single crystal silicon (SCS) specimens with reactively bonded Sn-3.5Ag solder joint by using specially developed four-point bending test equipment. In this paper, the influences of Al/Ni exothermic film thickness and metallic interlayer on the strength are discussed. The strength increases with increasing Al/Ni film thickness and pressure load during bonding. Metallic interlayer between the solder and SCS also affects the strength because fracture origin is dependent on the types of metals. The obtained results suggest that reacted NiAl is durable against external forces compared with the solder and interlayer.
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July 2015
Research-Article
Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints
Takahiro Namazu,
Takahiro Namazu
1
Associate Professor
Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
e-mail: namazu@eng.u-hyogo.ac.jp
Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
University of Hyogo
,2167 Shosha
,Himeji, Hyogo 671-2201
, Japan
e-mail: namazu@eng.u-hyogo.ac.jp
1Corresponding author.
Search for other works by this author on:
Kohei Ohtani,
Kohei Ohtani
Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
Department of Mechanical and
Systems Engineering,
University of Hyogo
,2167 Shosha
,Himeji, Hyogo 671-2201
, Japan
Search for other works by this author on:
Shozo Inoue,
Shozo Inoue
Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
Department of Mechanical and
Systems Engineering,
University of Hyogo
,2167 Shosha
,Himeji, Hyogo 671-2201
, Japan
Search for other works by this author on:
Shugo Miyake
Shugo Miyake
Kobelco Research Institute Inc.
,1-5-5 Takatsukadai
,Nishi-ku, Kobe, Hyogo 651-2271
, Japan
Search for other works by this author on:
Takahiro Namazu
Associate Professor
Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
e-mail: namazu@eng.u-hyogo.ac.jp
Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
University of Hyogo
,2167 Shosha
,Himeji, Hyogo 671-2201
, Japan
e-mail: namazu@eng.u-hyogo.ac.jp
Kohei Ohtani
Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
Department of Mechanical and
Systems Engineering,
University of Hyogo
,2167 Shosha
,Himeji, Hyogo 671-2201
, Japan
Shozo Inoue
Division of Mechanical Systems,
Department of Mechanical and
Systems Engineering,
Department of Mechanical and
Systems Engineering,
University of Hyogo
,2167 Shosha
,Himeji, Hyogo 671-2201
, Japan
Shugo Miyake
Kobelco Research Institute Inc.
,1-5-5 Takatsukadai
,Nishi-ku, Kobe, Hyogo 651-2271
, Japan
1Corresponding author.
Contributed by the Materials Division of ASME for publication in the JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY. Manuscript received December 18, 2014; final manuscript received April 4, 2015; published online May 8, 2015. Assoc. Editor: Tetsuya Ohashi.
J. Eng. Mater. Technol. Jul 2015, 137(3): 031011 (7 pages)
Published Online: July 1, 2015
Article history
Received:
December 18, 2014
Revision Received:
April 4, 2015
Online:
May 8, 2015
Citation
Namazu, T., Ohtani, K., Inoue, S., and Miyake, S. (July 1, 2015). "Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints." ASME. J. Eng. Mater. Technol. July 2015; 137(3): 031011. https://doi.org/10.1115/1.4030413
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