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Journal Articles

A New Surface Finishing Process for Quartz Glass Rotary Parts based on Changes in Wetting State

Accepted Manuscript
Yujie Liu, Hao Tong, Qifeng Tan, Yong Li, Jialong Chen
Journal: Journal of Micro and Nano Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Micro Nano Sci. Eng.
Paper No: JMNM-25-1005
https://doi.org/10.1115/1.4068446
Published Online: April 17, 2025
View Articletitled, A New Surface Finishing Process for Quartz Glass Rotary Parts based on Changes in Wetting State
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Topics: Glass, Quartz, Surface finishing, Wetting, Corrosion, Drops, Surface roughness, Damage, Etching, Finishing
Journal Articles

Effect of Laser Power and Diamond Tool Parameters for Micro Laser-Assisted Ductile Mode Material Removal on Fused Silica

Hassan Shirzadi Jahromi, Hossein Mohammadi, Sai K. Kode, Jonathan D. Ellis, Deepak Ravindra Menon
Journal: Journal of Micro and Nano Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Micro Nano Sci. Eng. March 2025, 13(1): 011001.
Paper No: JMNM-24-1018
https://doi.org/10.1115/1.4066943
Published Online: November 21, 2024
View Articletitled, Effect of Laser Power and Diamond Tool Parameters for Micro Laser-Assisted Ductile Mode Material Removal on Fused Silica
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Topics: Diamond tools, Geometry, Lasers, Silicon dioxide, Brittleness, Machining, Damage, Fracture (Materials)
Journal Articles

Multi-Objective Optimization of Wire-Electric Discharge Machined Ultrathin Silicon Wafers Using Response Surface Methodology for Solar Cell Applications

Divyanshu Bhartiya, Pinal Rana, Meinam Annebushan Singh, Deepak Marla
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. December 2020, 8(4): 041006.
Paper No: JMNM-20-1040
https://doi.org/10.1115/1.4049362
Published Online: January 18, 2021
View Articletitled, Multi-Objective Optimization of Wire-Electric Discharge Machined Ultrathin Silicon Wafers Using Response Surface Methodology for Solar Cell Applications
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Topics: Damage, Electrical discharge machining, Optimization, Semiconductor wafers, Wire, Response surface methodology, Pareto optimization, Composite materials, Solar cells, Machining
Journal Articles

Machining Response and Damage Evolution of Amorphous Carbon Coated Tools in High-Speed Micromilling of Ti–6Al–4V

Rinku K. Mittal, Salil S. Kulkarni, Harish Barshilia, Ramesh Singh
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. June 2020, 8(2): 024507.
Paper No: JMNM-19-1060
https://doi.org/10.1115/1.4046192
Published Online: March 27, 2020
View Articletitled, Machining Response and Damage Evolution of Amorphous Carbon Coated Tools in High-Speed Micromilling of Ti–6Al–4V
Open the PDF for Machining Response and Damage Evolution of Amorphous Carbon Coated Tools in High-Speed Micromilling of Ti–6Al–4V in another window
Topics: Carbon, Coating processes, Coatings, Cutting, Damage, Machining, Micromilling, Damage assessment, Friction, Lubricants
Journal Articles

A Study on the Damage Layer Removal of Single-Crystal Silicon Wafer After Atmospheric-Pressure Plasma Etching

Weijia Guo, Senthil Kumar Anantharajan, Xinquan Zhang, Hui Deng
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. June 2020, 8(2): 024501.
Paper No: JMNM-19-1045
https://doi.org/10.1115/1.4046377
Published Online: March 27, 2020
View Articletitled, A Study on the Damage Layer Removal of Single-Crystal Silicon Wafer After Atmospheric-Pressure Plasma Etching
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Topics: Atmospheric pressure, Crystals, Damage, Etching, Plasma etching, Plasmas (Ionized gases), Semiconductor wafers, Silicon, Surface roughness