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Aathi Raja Ram Pandurangan
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Journal Articles

Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034502.
Paper No: EP-22-1028
https://doi.org/10.1115/1.4064604
Published Online: March 7, 2024
View Article titled, Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure
Open the PDF for Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure in another window
Topics: Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture toughness, Stress, Delamination, Temperature, Reliability, Printed circuit boards
Proceedings Papers

Predictive Modeling of High-G Potted Assemblies With Fine Pitch Electronics After Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111950
https://doi.org/10.1115/IPACK2023-111950
View Paper titled, Predictive Modeling of High-G Potted Assemblies With Fine Pitch Electronics After Sustained High-Temperature Exposure
Open the PDF for Predictive Modeling of High-G Potted Assemblies With Fine Pitch Electronics After Sustained High-Temperature Exposure in another window
Topics: Delamination, Electronics, High temperature, Modeling, Shock (Mechanics)
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
Open the PDF for Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model in another window
Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework

Pradeep Lall, Padmanava Choudhury, Aathi Raja Ram Pandurangan
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112014
https://doi.org/10.1115/IPACK2023-112014
View Paper titled, Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework
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Topics: Elastic moduli, Glass, Manufacturing, Resins, Stress, Tensile strength
Proceedings Papers

Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows

Pradeep Lall, Aathi Raja Ram Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111925
https://doi.org/10.1115/IPACK2023-111925
View Paper titled, Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows
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Topics: Copper, Fracture (Materials), Fracture (Process), Resins
Proceedings Papers

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97427
https://doi.org/10.1115/IPACK2022-97427
View Paper titled, Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure
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Topics: Delamination, Epoxy adhesives, Epoxy resins, High temperature, Modeling
Proceedings Papers

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97424
https://doi.org/10.1115/IPACK2022-97424
View Paper titled, Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
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Topics: Delamination, Fatigue, Fracture toughness, Temperature
Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74062
https://doi.org/10.1115/IPACK2021-74062
View Paper titled, Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
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Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components
Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2648
https://doi.org/10.1115/IPACK2020-2648
View Paper titled, Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies
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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics
Proceedings Papers

Effect of Drop Angle Variation and Restraint Mechanisms on Surface Mount Electronics Under High G Shock

Pradeep Lall, Aathi Raja Ram Pandurangan, Venkata Kalyan Reddy Dornala, Jeff Suhling, John Deep, Ryan Lowe
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A013, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6575
https://doi.org/10.1115/IPACK2019-6575
View Paper titled, Effect of Drop Angle Variation and Restraint Mechanisms on Surface Mount Electronics Under High G Shock
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Topics: Electronics, Shock (Mechanics), Surface mount packaging